tag: Intel

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

EUV Still Matters…But Less
By Ed Sperling - 16 Oct, 2014 - Comments: 0

For all the chatter and occasional tirades about EUV missing its market window—it's true, EUV will have missed five market windows by 10nm—it still matters. And the sooner EUV hits the market with a viable power source, the better off the entire semiconductor manufacturing industry will be. But even EUV is a sideshow to some important shifts underway in technology. While technologically ... » read more

Litho Options Sparse After 10nm
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Leading-edge foundries are ramping up their 16nm/14nm logic processes, with 10nm and 7nm in R&D. Barring a major breakthrough in [getkc id="80" comment="lithography"], chipmakers will use 193nm immersion and multiple patterning for both 16nm/14nm and 10nm. So now, chipmakers are focusing on the lithography options for 7nm. As before, the options include the usual suspects—[gettech id="... » read more

ATE Market Gets More Crowded
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Over the years, the automatic test equipment (ATE) industry has undergone a dramatic shakeout. In fact, the ATE industry has shrunk from about a dozen major vendors several years ago to just three sizable companies today. There is also a smattering of smaller ATE players in the market. In other words, the big ATE vendors became bigger and the mid-sized players were gobbled up. The consol... » read more

Challenges Mount For EUV Masks
By Mark LaPedus - 16 Oct, 2014 - Comments: 2

Five years ago, Intel urged the industry to invest millions of dollars in the photomask infrastructure to help enable extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography. At the time, there were noticeable gaps in EUV, namely defect-free masks and inspection tools. To date, however, Intel’s call to action has produced mixed results. The photomask industry is making progr... » read more

Time To Look At SOI Again
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Chipmakers have the luxury of looking at several process options when developing chips at the 28nm node and beyond. Using bulk CMOS, for example, chipmakers can scale planar transistors down to 20nm. Then, at 20nm, planar runs out of gas due to the so-called short-channel effect. At that point, IC makers must migrate towards finFETs at 16nm/14nm and beyond. Another process option is fully... » read more

Another Inventory Glut?
By Jim Feldhan - 16 Oct, 2014 - Comments: 0

For nearly a year, Semico’s IPI index has been indicating that the fundamental demand in the second half of 2014 would be seasonally weak. Back in early 2013, our initial view for 2014 was a 10% market growth. However, as the IPI declined in the second half of 2013 we revised our semiconductor revenue forecast down to 7.3% heeding the warning that was projected by the Semico IPI index. This w... » read more

The Week In Review: Design
By Ed Sperling - 10 Oct, 2014 - Comments: 0

IP Synopsys rolled out verification IP for mobile PCIe, including built-in M-PHY, for UVM environments. Cadence introduced MIPI SoundWire controller IP, which allows bi-directional digital communication using low gate count and minimal complexity. Deals ARM and TSMC rolled out a road map for 64-bit ARM-based processors at 10nm. The companies said the early pathfinding work is expected t... » read more

Embedded At DAC
By Anne Cirkel - 10 Oct, 2014 - Comments: 0

It seems to be one of DAC’s best kept secrets – right up there with what happened to Free Monday – that about 30% of the conference content is focused on embedded systems and software (ESS). The call for contributions is still open and I want to remind you that you can submit your research work in ESS to DAC. When Leon Stok of IBM was General Chair for the 48th DAC he started our embedded... » read more

Driving Memory Beyond DDR4
By Frank Ferro - 09 Oct, 2014 - Comments: 0

While attending recent technology trade shows, the Intel Developer’s Forum (IDF) in August and last week’s ARM TechCon, I participated in many interesting discussions around server performance, power consumption, memory bandwidth and capacity. The race to introduce higher-performing servers that consume less power is fueled by the growing demand for new applications in the enterprise, commu... » read more

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