Devices And Transistors For The Next 75 Years

By Laura Peters - 16 Feb, 2023 - Comments: 0

The 75th anniversary of the invention of the transistor sparked a lively panel discussion at IEDM, spurring debate about the future of CMOS, the role of III-V and 2D materials in future transistors, and what will be the next great memory architecture.[1] Industry veterans from the memory, logic, and research communities see high-NA EUV production, NAND flash with 1,000 layers, and hybrid bon... » read more

2D Semiconductor Materials Creep Toward Manufacturing

By Katherine Derbyshire - 16 Feb, 2023 - Comments: 0

As transistors scale down, they need thinner channels to achieve adequate channel control. In silicon, though, surface roughness scattering degrades mobility, limiting the ultimate channel thickness to about 3nm. Two-dimensional transition metal dichalcogenides (TMDs), such as MoS2 and WSe2, are attractive in part because they avoid this limitation. With no out-of-plane dangling bonds and at... » read more

Chiplets Taking Root As Silicon-Proven Hard IP

By Ann Mutschler - 09 Feb, 2023 - Comments: 0

Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

Blog Review: Feb. 8

By Jesse Allen - 08 Feb, 2023 - Comments: 0

Cadence's Sanjeet Kumar points to key changes and optimizations that are done for USB3 Gen T compared to USB3 Gen X tunneling in order to minimize tunnel overhead and maximize USB3 throughput. Siemens EDA's Harry Foster considers the effectiveness of IC and ASIC verification by looking at schedule overruns, number of required spins, and classification of functional bugs. Synopsys' Chris C... » read more

Hunting For Hardware-Related Errors In Data Centers

By Anne Meixner - 07 Feb, 2023 - Comments: 2

The semiconductor industry is urgently pursuing design, monitoring, and testing strategies to help identify and eliminate hardware defects that can cause catastrophic errors. Corrupt execution errors, also known as silent data errors, cannot be fully isolated at test — even with system-level testing — because they occur only under specific conditions. To sort out the environmental condit... » read more

Chip Industry’s Earnings Roundup

By Linda Christensen - 06 Feb, 2023 - Comments: 0

Editor's Note: Updated throughout February 2023 for additional earnings releases. Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for consumer electronics softened due to inflation, rising interest rates, and post-pandemic market saturation, creating a slump in the memory chip ... » read more

Week in Review: Design, Low Power

By Jesse Allen - 03 Feb, 2023 - Comments: 0

Intel discontinued its Pathfinder for RISC-V program, according to numerous reports. The program provided a pre-silicon development environment to support IP selection and early-stage software development using Intel FPGA and simulator platforms. "Since Intel will not be providing any additional releases or bug fixes, we encourage you to promptly transition to third-party RISC-V software tools ... » read more

Solving Problems With The IoT

By John Koon - 02 Feb, 2023 - Comments: 0

The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

Improving Performance And Power With HBM3

By Andy Patrizio - 30 Jan, 2023 - Comments: 0

HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

CXL Picks Up Steam In Data Centers

By Marie C. Baca - 26 Jan, 2023 - Comments: 0

CXL is gaining traction inside large data centers as a way of boosting utilization of different compute elements, such as memories and accelerators, while minimizing the need for additional racks of servers. But the standard is being extended and modified so quickly that it is difficult to keep up with all the changes, each of which needs to be verified and validated across a growing swath of h... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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