tag: Intel

Week in Review: Iot, Security, Automotive
By Susan Rambo - 08 Nov, 2019 - Comments: 0

IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Blog Review: Nov. 6
By Jesse Allen - 06 Nov, 2019 - Comments: 0

Cadence's Paul McLellan considers why high-performance compute, high-performance networks, and security will all be vital to the next wave of devices and the importance of optimization. Synopsys' Taylor Armerding points to some best practices for assessing your supply chain to find the weak links that could lead to a security breach, from why to make it a priority to what to ask software ven... » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Blog Review: Oct. 30
By Jesse Allen - 30 Oct, 2019 - Comments: 0

Cadence's Paul McLellan checks out the future of the automotive industry, the options for making the transition to autonomous driving, and how experience with electric vehicles influences perception of them. In a video, Mentor's Colin Walls digs into the challenges of testing memory in an embedded system. A Synopsys writer looks at doubling bandwidth in PCIe 5.0, the PHY logical changes a... » read more

Week In Review: Design, Low Power
By Jesse Allen - 25 Oct, 2019 - Comments: 0

ANSYS will acquire Dynardo, a provider of simulation process integration and design optimization (PIDO) technology. Dynardo's tools include algorithms for optimization, uncertainty quantification, robustness, scenario variation, sensitivity analysis, simulation workflow building and data mining. Based in Weimar, Germany, Dynardo was founded in 2001 and has been an ANSYS software partner; the ac... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 25 Oct, 2019 - Comments: 0

Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Oct, 2019 - Comments: 0

Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

What’s The Best Advanced Packaging Option?
By Mark LaPedus - 17 Oct, 2019 - Comments: 2

As traditional chip designs become more unwieldy and expensive at each node, many IC vendors are exploring or pursuing alternative approaches using advanced packaging. The problem is there are too many advanced packaging options on the table already, and the list continues to grow. Moreover, each option has several tradeoffs and challenges, and all of them are still relatively expensive. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

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