tag: Intel

Racing To The Edge
By Susan Rambo And Ed Sperling - 09 Apr, 2019 - Comments: 0

The race is on to win a piece of the edge, despite the fact that there is no consistent definition of where the edge begins and ends or how the various pieces will be integrated or ultimately tested. The edge concept originated with the Internet of Things, where the initial idea was that tens of billions of dumb sensors would communicate through gateways to the cloud. That idea persisted unt... » read more

How To Manage DFT For AI Chips
By Rahul Singhal - 09 Apr, 2019 - Comments: 0

Semiconductor companies are racing to develop AI-specific chips to meet the rapidly growing compute requirements for artificial intelligence (AI) systems. AI chips from companies like Graphcore and Mythic are ASICs based on the novel, massively parallel architectures that maximize data processing capabilities for AI workloads. Others, like Intel, Nvidia, and AMD, are optimizing existing archite... » read more

3D NAND Metrology Challenges Growing
By Mark LaPedus - 09 Apr, 2019 - Comments: 8

3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems and ensure yields for all chip types. In the case of 3D NAND, the metrology tools are becoming more expensive at each iteration... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Apr, 2019 - Comments: 0

Public policy The rise of the digital economy is creating millions of new jobs, but it’s difficult to fill these positions. So, the Consumer Technology Association (CTA), a U.S.-based trade group, is encouraging hi-tech companies to offer more apprenticeships. This is especially true for software engineering, networking, data analytics, cybersecurity and artificial intelligence. The Semic... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Apr, 2019 - Comments: 0

Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

Blog Review: April 3
By Jesse Allen - 03 Apr, 2019 - Comments: 0

Synopsys' Taylor Armerding contends that as the IoT becomes more ubiquitous, the threat of cyber-physical attacks is rising, with the potential for a domino effect if even simple devices are compromised in large enough quantities. Mentor's Colin Walls considers the move away from programming on bare metal with the rise of drivers and RTOSes and when it makes sense to still use the old method... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2019 - Comments: 0

Rambus' Steven Woo takes a look at the memory requirements of neural networks and why some companies are using on-chip memory while others are using HBM2 or GDDR6. Cadence's Lana Chan  observes growing momentum for NVMe and highlights some new features in the latest specification that are pushing mainstream adoption forward. Mentor's Matthew Ballance contends that when it comes to adopti... » read more

Data-Driven Verification Begins
By Ed Sperling - 27 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss data-driven verification with Yoshi Watanabe, senior software architect at Cadence; Hanan Moller, systems architect at UltraSoC; Mark Conklin, principal verification engineer at Arm; and Hao Chen, senior design engineer at Intel. What follows are excerpts of that conversation, which was conducted in front of a live audience at DVCon. (L-R) Yosh... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Materials M&A Mania
By Mark LaPedus - 21 Mar, 2019 - Comments: 0

The electronics materials business has seen a wave of mergers and acquisitions in recent times. Clearly, it’s important to keep tabs on this industry. Vendors in the electronics materials business are critical to the supply chain—they provide the key gases, materials and other products for various industries, such as display, MEMS, packaging, semiconductor and others. But it takes a s... » read more

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