tag: Intel

3D NAND Flash Wars Begin
By Mark LaPedus - 20 Aug, 2018 - Comments: 0

3D NAND suppliers are gearing up for a new battle amid a period of price and competitive pressures, racing each other to the next technology generations. Competition is intensifying as a new player enters the 3D NAND market—China’s Yangtze Memory Technologies Co. (YMTC). Backed by billions of dollars in funding from the Chinese government, YMTC recently introduced its first 3D NAND techn... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Aug, 2018 - Comments: 0

Intel disclosed a speculative execution side-channel attack method called L1 Terminal Fault (L1TF). Leslie Culbertson, Intel's executive vice president and general manager of Product Assurance and Security, writes: "This method affects select microprocessor products supporting Intel Software Guard Extensions (Intel SGX) and was first reported to us by researchers at KU Leuven University, Techni... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 17 Aug, 2018 - Comments: 0

Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

Next-Gen Memory Ramping Up
By Mark LaPedus - 16 Aug, 2018 - Comments: 6

The next-generation memory market is heating up as vendors ramp a number of new technologies, but there are some challenges in bringing these products into the mainstream. For years, the industry has been working on a variety of memory technologies, including carbon nanotube RAM, FRAM, MRAM, phase-change memory and ReRAM. Some are shipping, while others are in R&D. Each memory type is di... » read more

More Performance At The Edge
By Ed Sperling - 09 Aug, 2018 - Comments: 0

Shrinking features has been a relatively inexpensive way to improve performance and, at least for the past few decades, to lower power. While device scaling will continue all the way to 3nm and maybe even further, it will happen at a slower pace. Alongside of that scaling, though, there are different approaches on tap to ratchet up performance even with chips developed at older nodes. This i... » read more

Blog Review: Aug. 8
By Jesse Allen - 08 Aug, 2018 - Comments: 0

Cadence's Meera Collier provides a primer on the basics of quantum computing, including how quantum gates work using superpositions and how it could impact chip design. Mentor's Dennis Brophy shares a list of resources to help you get up to speed on the recently-approved Portable Test and Stimulus standard, which enables test scenarios to be run across different execution platforms. Synop... » read more

Agile Standards
By Brian Bailey - 08 Aug, 2018 - Comments: 0

Semiconductor Engineering sat down with Lu Dai, chairman for Accellera and senior director of engineering at Qualcomm, to discuss what's changing in standards development. What follows are excerpts of that conversation. SE: Accellera has had a great first half of the year. Dai: Yes, we are only half way through the year and yet we got Portable Stimulus Standard (PSS) out, the SystemC CCI ... » read more

The Chiplet Race Begins
By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Return Of The Organic Interposer
By Ed Sperling - 06 Aug, 2018 - Comments: 2

Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Taking Inductance And Electromagnetic Effects More Seriously
By Magdy Abadir - 03 Aug, 2018 - Comments: 0

By Magdy Abadir and Yehea Ismail With increasing frequencies, tighter margins, denser integrated circuits, new devices and materials, the necessity of full EM analysis including magnetic/inductive effects is becoming a fundamental question for the industry. Where and when should full EM verification be included? Can some of major chip failures during development be attributed to ignoring ... » read more

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