tag: Intel

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Mixed Outlook For Semi Biz
By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Jul, 2018 - Comments: 0

Chipmakers TSMC has reduced its outlook for 2018 revenue and capital spending, according to Bloomberg. The company blamed the outlook on sluggish “mobile and digital currency mining demand,” according to the report. Samsung has developed the industry’s first 10nm-class 8-gigabit LPDDR5 DRAM. The 8Gb LPDDR5 boasts a data rate of up to 6,400 megabits-per-second (Mb/s), which is 1.5 tim... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 20 Jul, 2018 - Comments: 0

Cybersecurity Rambus signed a patent license agreement with Socionext, a designer of system-on-a-chip devices. Socionext will use Rambus technology in memory controllers, serializers/deserializers, and security applications. Netskope acquired Sift Security, adding 10 technical employees to its headcount of more than 500 people; financial terms weren’t revealed. Sift CEO Neil King was tapp... » read more

FD-SOI Going Mainstream
By Ed Sperling - 19 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Blog Review: July 18
By Jesse Allen - 18 Jul, 2018 - Comments: 0

Synopsys' Shivani Bansal introduces DFI 5.0, the latest interface specification that defines signals, timing, and functionality required for efficient communication between the memory controller and PHY, including changes to boost performance in DDR5/LPDDR5. Mentor's Ricardo Anguiano contends that for greater autonomy in vehicles, centralized sensor fusion is necessary to both reduce the cos... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 13 Jul, 2018 - Comments: 0

Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Jul, 2018 - Comments: 0

M&A Intel will acquire fabless company eASIC. Founded in 1999, eASIC sells structured ASIC platforms that act as a midpoint between FPGAs and standard cell ASICs by combining FPGA-like logic and design flows with single via routing. Eventually, Intel sees potential in using its Embedded Multi-Die Interconnect Bridge (EMIB) technology to combine Intel FPGAs with structured ASICs in a system... » read more

Bridges Vs. Interposers
By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy