Don’t Be The Dinosaur On IP Reuse


In today’s competitive marketplace, IP assets are becoming more critical and strategic than ever before. There is a general understanding among all design companies that one needs to invest and reuse IPs within the enterprise for faster realization of an IP sub-system or an SoCs. Unfortunately, from the start most companies have failed to adopt the processes for developing and reusing their I... » read more

designHUB: Design Reuse Made Real


It’s no secret: You can’t get to market quickly or efficiently without integrating and re-using IP technology in your system-on-chip (SoC) design. In the past 10 years alone, design re-use has doubled to the point where today you’ll find more than 150 reused blocks comprising 60-70% of the die area in an average SoC. The companies most successful with their IP-reuse strategies are thos... » read more

The Limits Of IP Reuse


The basic business proposition for third-party IP is that it's cheaper, faster, and less problematic to buy rather than build. But things haven't exactly worked out according to plan, either for companies that license IP or those that develop it. For [getkc id="43" kc_name="IP"] licensees, just keeping track of an endless series of updates is becoming unwieldy. Complex designs often include ... » read more

IP Business Changing As Markets Shift


Semiconductor Engineering sat down to discuss IP protection, tracking and reuse with Srinath Anantharaman, CEO of [getentity id="22203" e_name="ClioSoft"]; and Jeff Galloway, CTO of Silicon Creations; Marc Greenberg, group director of product marketing for [getentity id="22032" e_name="Cadence"]'s IP Group; and John Koeter, vice president of marketing for [getentity id="22035" e_name="Synopsys"... » read more

Re-Using IP In Packaging


For the past decade, the promise held forth by advanced packaging was that it would allow chipmakers to mix and match analog and digital IP without worrying about the process node at which they were developed or the physical interactions between components. This is a big deal when it comes to analog. Analog IP doesn't benefit from node shrinking the way digital logic does, and in many cases ... » read more

Verification Facing Unique Inflection Point


The Design and Verification Conference and Exhibition (DVCon) attracted more than 1,100 people to San Jose last week, just slightly less than last year. While a lot of focus, and most of the glory, goes to design within semiconductor companies, it is verification where most of the advancements are happening and thus the bigger focus for DVCon. The rate of change in verification and the producti... » read more

Powerful New Standard


In December 2015, the IEEE released the latest version of the 1801 specification, titled the IEEE standard for design and verification of low-power integrated circuits, but most people know it as UPF or the Unified Power Format. The standard provides a way to specify the power intent associated with a design. With it, a designer can define the various power states of the design and the contexts... » read more

Bridging Hardware And Software


Methodology and reuse are two fairly standard concepts when it comes to semiconductor design, but they're viewed completely differently by hardware and software teams. It's a given that hardware and software have different goals and opinions about how best to do design. And while all agree that a single methodology can pay dividends in future chips, there is disagreement over who should shap... » read more

The Beginning


We all want our creations to transcend time. Our products, our designs—even our specifications. Specifications are more than just ideas or collections of requirements or static collections of implementation details. They live inside many chips and many designs, and the more flexible and portable they are, the longer they remain relevant. End devices may be replaced relatively quickly, but ... » read more

A New Reuse Paradigm To Take 2.5D Packaging Technology Mainstream


With all of the recent product implementations and demonstrations of the technical viability of 2.5D technology, there is a lot of excitement around its potential. However, as with any new technology, there are concerns with cost and risk that limit mainstream adoption. Cost reduction and risk mitigation require some level of volume production, and therein lies a classic Catch-22. Is there a wa... » read more

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