tag: IP-XACT

Design Complexity In The Golden Age Of Semiconductors
By Frank Schirrmeister - 24 Aug, 2023 - Comments: 0

While writing last month's blog that used some of the trend charts we have seen, I noticed that a lot of the data ends in 2020 or earlier, but I was too close to the deadline to sit down and make orderly updates to some of the charts. Working day-to-day in the area of SoC integration and networks-on-chips (NoCs), the classic chart based on Karl Rupp's now 50 years of processor data that overlay... » read more

A Design Flow For Critical Embedded Systems
By Arteris - 23 Aug, 2023 - Comments: 0

Learn how IP encapsulation/packaging and interoperability using IP-XACT enabled automation in a complex verification & validation flow for aeronautical systems. Includes usage of these capabilities integrated using Arteris SoC integration technology: HW/SW codesign RTL, SystemC TLM and PSL Instruction Set Simulators Click here to read more. » read more

The Design Automation Conference Turns 60! What’s Hot? What’s Next?
By Frank Schirrmeister - 06 Jul, 2023 - Comments: 0

This coming week from July 9th to July 13th, experts from all over the world will descend on the Moscone Center in San Francisco to discuss aspects of what we call "Electronic Design Automation" (EDA) and typically associate with hardware development. There will be many celebratory elements this year, given the milestone of 60 years. Industry luminary Alberto Sangiovanni Vincentelli will give o... » read more

A New Breed Of EDA Required
By Brian Bailey - 23 Jun, 2022 - Comments: 1

While doing research for one of my stories this month, a couple of people basically said that applying methodologies of the past to the designs of today can be problematic because there are fundamental differences in the architectures and workloads. While I completely agree, I don't think these statements go far enough. Designs of today generally have one of everything — one CPU, one accel... » read more

Using IP-XACT To Solve Design And Verification Problems
By Anika Malhotra - 13 Oct, 2021 - Comments: 0

As today’s SoC designs grow more complex and time-to-market (TTM) pressures rise, designers are looking for techniques to build and update designs easily. Key elements for addressing these SoC challenges include the incorporation of more commercial IP components, internal design IP reuse, and extensive automation of design and verification activities. Enhanced interoperability and reusability... » read more

Steering The Semiconductor Industry
By Brian Bailey - 26 Aug, 2021 - Comments: 2

Progress in semiconductors has been one of the most successful engineering feats, and the industry has ridden an exponential curve longer than anything else in history. It is also a highly conservative industry that has pushed away many disruptive changes in favor of small incremental changes that minimize risk. There have been significant changes over the decades, and they often required a ... » read more

IP-XACT Is Back, For All The Right Reasons
By Vincent Thibaut - 01 Jul, 2021 - Comments: 0

The intent behind IP-XACT has always been to provide a bridge between system-on-chip (SoC) assembly and larger considerations. This standard has additionally been used to adapt to multi-sourced and constantly evolving intellectual property (IP) that design and product teams build, often in different companies. Moreover, it was used to interface with product development beyond the specialized ne... » read more

An Acquisition To Streamline SoC Integration
By Kurt Shuler - 15 Feb, 2021 - Comments: 0

Late last year Arteris IP closed its acquisition of Magillem assets, bringing together two companies with a single mission: To support integration of systems-on-chip (SoCs) at the interconnect fabric level and the data integration level. The value of joining forces has been appealing for some time. Since the early days of both companies, we’ve been working with mutual customers and integratio... » read more

Do You Trust Your IP Supplier?
By Brian Bailey - 26 Mar, 2020 - Comments: 0

How much do you trust your IP supplier, regardless of whether IP was developed in-house or by a third-party provider? And what implications does it have a system integrator? These are important questions that many companies are beginning to ask. Today, there are few methods, other than documentation, that provide the necessary information. The software industry may be ahead of the hardware i... » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

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