Can You Afford To Waste Time On Your Next Design Project?

By Amit Varde - 09 Jan, 2020 - Comments: 0

Let’s be honest: engineers are asked to perform miracles every day, and they almost always deliver. They are challenged to invent the future in the form of newly sophisticated, powerful and highly functional systems-on-chips and systems. On top of this, they’re required to do so with an increasingly complex array of tools and re-use increasing amounts of IP to speed time-to-market. Oh, and ... » read more

Security Risks In The Supply Chain

By Ed Sperling - 09 Jan, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security in the supply chain with Warren Savage, research scientist in the Applied Research Laboratory for Intelligence and Security at the University of Maryland; Neeraj Paliwal, vice president and general manager of Rambus Security; Luis Ancajas, marketing director for IoT security software solutions at Micron; Doug Suerich, product evangelist at ... » read more

EDA, IP Growth Surge

By Ed Sperling - 07 Jan, 2020 - Comments: 1

EDA and IP grew 8.9% in Q3 of 2019, according to a just-released report, indicating continued confidence in semiconductor growth. Total revenue was up 8.9% globally compared with the same period in 2018, but that number is deceptively low. Revenue in China, for example, increased 5.7% compared to the same quarter in 2018, despite trade restrictions on sales of any IP developed in the United ... » read more

Crossed Wires On Domains

By Brian Bailey - 19 Dec, 2019 - Comments: 1

Clock, power and reset domains can form a tangled web if systems are not architected correctly. Wires that cross these domains often require special treatment and additional analysis. They are all evolving independently, meaning that designers must keep up with the latest methodology guidelines and tool capabilities to ensure problems do not remain hidden until they get exposed in silicon. C... » read more

A Promising Future For Interconnect IP

By Rich Wawrzyniak - 17 Dec, 2019 - Comments: 0

Complexity of SoC designs continues to increase primarily due to increased demand for functionality and performance in all electronic devices. Studies that Semico Research has conducted on the SoC design landscape shows the number of discrete SIP blocks has continued to rise in response to increased market requirements from new applications and richer feature sets. Table 1: Comparison of 1st... » read more

A New Dawn For IP

By Brian Bailey - 12 Dec, 2019 - Comments: 0

The IP industry is changing again. The concept started as build once, use everywhere, but today it is more like architect once, customize everywhere. Few designs can afford sub-optimal IP for their application. The need for customized IP is driven by both leading-edge designs and the trailing markets, although for different reasons. While this customization is causing IP companies to transfo... » read more

Challenges In IP Reuse

By Ed Sperling - 09 Dec, 2019 - Comments: 0

Jeff Markham, software architect at ClioSoft, explains why IP reuse is so important in advanced process node SoC chip designs, what companies need to keep track of when working with third-party IP, and how it needs to be characterized. » read more

Finding Hardware Trojans

By Ed Sperling - 03 Dec, 2019 - Comments: 0

John Hallman, product manager for trust and security at OneSpin Technologies, looks at how to identify hardware Trojans in a design, why IP from different vendors makes this more complicated, and how a digital twin can provide a reference point against which to measure if a design has been compromised. » read more

Thoroughly Verifying Complex SoCs

By Ann Mutschler - 26 Nov, 2019 - Comments: 0

The number of things that can go wrong in complex SoCs targeted at leading-edge applications is staggering, and there is no indication that verifying these chips will function as expected is going to get any easier. Heterogeneous designs developed for leading-edge applications, such as 5G, IoT, automotive and AI, are now complex systems in their own right. But they also need to work in conju... » read more

Enhancing IO Ring Checks For Consistent, Customizable Verification

By Mentor, a Siemens Business - 25 Nov, 2019 - Comments: 0

The Calibre PERC IO ring checker framework eliminates manual checking by providing a robust DRC-like environment to verify all IO placement rules with sign-off quality. Running on the first LEF/DEF floorplan, the IO ring checker provides early and full coverage of IO ring placement rules, enabling changes with minimal impact on the layout. Fast, accurate debugging and correction ensures that So... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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