EDA, IP Numbers Up


EDA and IP numbers increased another 8.5% in Q2, with all regions but Japan showing positive growth. Total revenue was $1.91 billion for the quarter, up from $1.76 billion in Q2 of 2014. The largest category, computer-aided engineering, was $657.2 million for the quarter, up 9.6% compared with the same period last year. IC physical design was $379.2 million, up 6% year over year, and IP was ... » read more

Is The 2.5D Supply Chain Ready?


A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Is HW Or SW Running the Show?


In the past, hardware was designed and then passed over to the software team for them to add their contribution to the product. This worked when the amount of software content was small and the practice did not significantly contribute to product delays. Over time, the software content grew and today it is generally accepted that software accounts for more product expense than hardware, takes l... » read more

Can IP Integration Be Automated?


What exactly does it mean to automate [getkc id="43" comment="IP"] integration? Ask four people in the industry and you’ll get four different answers. “The key issue is how you can assemble the hardware as quickly as you can out of pre-made pieces of IP,” said Charlie Janac, chairman and CEO of [getentity id="22674" e_name="Arteris"]. To Simon Rance, senior product manager in the ... » read more

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations


When companies consider purchasing Semiconductor IP (SIP), they often have a strict procedure for evaluating third-party vendors and their products. If they don’t have a set way of evaluating IP, the Global Semiconductor Alliance (GSA) has developed a Hard IP Licensing Risk Assessment Tool to aid in assessing the value of IP (there is also a quality assessment tool). This aid is part of the G... » read more

The Next Level Of Abstraction For System Design


Recently there have been a lot of discussions again about the next level of design abstraction for chip design. Are we there yet? Will we ever get there? Is it SystemC? UML/SysML perhaps? I am taking the approach of simply claiming victory: Over the last 20 years we have moved up beyond RTL in various areas—just in a fragmented way. However, the human limitations on our capacity for processin... » read more

The Price Of Consolidation


Consolidation is causing far-reaching changes across the global semiconductor ecosystem due to the size of companies being bought and the dearth of startups to replenish those being acquired. Coupled with the rising cost and difficulty of shrinking features down to advanced process nodes—many argue that is the largest driver of consolidation—the market dynamics for who's buying IP, EDA t... » read more

FinFET Technology


This white paper discusses the major challenges with FinFETs and how TSMC has been collaborating with Synopsys, one of their ecosystem partners, to deliver a complete solution. Key elements of this solution include comprehensive FinFET profiling without impact to design tool runtime and proven, verified IP availability. The TSMC 16-nm FinFET solution will ensure mutual customers swiftly move to... » read more

ESL: 20 Years Old, 10 To Go


It is a common perception that the rate of technology adoption accelerates. In 1873, the telephone was invented and, after 46 years, it had been adopted by one-quarter of the U.S. population. Television, invented in 1926 took 26 years. The PC in 1975 took just 16 years. It took only 7 years after the introduction of the Internet in 1991 before it was seeing significant levels of adoption. So... » read more

Appetite For Services Grows


Semiconductor service revenues have been growing for the past year, fueled by complex thermal and power issues at advanced nodes, the difficulty of integrating more and more IP blocks, and far more techniques, languages and methodologies that engineers need to learn to be productive in the finFET generation. The services business typically acts as a bridge between down and up cycles in the c... » read more

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