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Week In Review: Manufacturing, Test


Highlights from ITC The hot topic at this week’s International Test Conference (ITC) was tackling silent data corruption, with panel discussions, papers, and Google’s Parthasarathy Ranganathan’s keynote address all emphasizing the urgency of the issue. In the past two years Meta, Google, and Microsoft have reported on silent errors, errors not detected at test, which are adversely impact... » read more

Auto Chipmakers Dig Down To 10ppb


How do engineers deliver 10 defective parts per billion (Dppb) to auto makers if they only screen 1 million parts per year? Answer: By comprehending failure mechanisms and proactively screening for them. Modern automobiles contain nearly 1,000 ICs that must perform over the vehicle’s life (15 years). This drives quality expectations ever higher. While 10 Dppm used to be a solid benchmark, ... » read more

Week In Review: Manufacturing, Test


Chipmakers Chip investments in Malaysia got a shot in the arm this week. First, Intel has announced plans to invest more than RM30 billion, or US$7 billion, within its Malaysian packaging and test facilities. The additional investment will help expand Intel Malaysia’s operations across Penang and Kulim. This new investment is expected to create over 4,000 Intel jobs as well as over 5,000 con... » read more

Speeding Up Scan-Based Volume Diagnosis


In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

The Era Of Packetized Scan Test Has Arrived


For decades, process and design scaling has triggered the adoption of transformative test solutions. About twenty years ago, when at-speed test became a de-facto requirement, on-chip compression became the norm to address test data time and volume. Over the last decade, hierarchical DFT enabled DFT engineers to apply a divide and conquer on large design, improving both implementation effort and... » read more

Too Much Fab And Test Data, Low Utilization


Can there be such a thing as too much data in the semiconductor and electronics manufacturing process? The answer is, it depends. An estimated 80% or more of the data collected across the semiconductor supply chain is never looked at, from design to manufacturing and out into the field. While this may be surprising, there are some good reasons: Engineers only look at data necessary to s... » read more

Auto Outlook: Down But Not Out


For years, automotive has been an engine of growth in the semiconductor industry, although the market is expected to decline in 2020. Several types of chips are used in automobiles, such as analog, memory, microcontrollers, processors and RF. But the automotive IC business still represents a small percentage of the overall semiconductor market. It pales in comparison to the smartphone chip m... » read more

Testing In Context Gaining Ground


Testing in context is beginning to gain wider appeal as chip complexity increases, and as ICs are deployed in more safety-critical and mission-critical applications. While design in context has been the norm for SoCs for some time, a similar approach in test has been slow going. Cell-aware testing technology was first described a decade ago, and since then its adoption has been modest. But w... » read more

Week In Review: Manufacturing, Test


Packaging and test TrendForce has released its top-10 OSAT rankings in terms of sales for the third quarter of 2019. ASE was in first place in the rankings, followed by Amkor and JCET. “According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales stead... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

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