tag: Keio University

Chip Industry Technical Paper Roundup: Sept. 3
By Linda Christensen - 03 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Analysis of the Errors of High-Fidelity Two-Qubit Gates in Silicon Quantum Dots (UNSW et al.)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Assessment of the errors of high-fidelity two-qubit gates in silicon quantum dots" was published by researchers at UNSW, Diraq, Sandia National Laboratories, Keio University, Leibniz-Institut für Kristallzüchtung and others. Abstract "Achieving high-fidelity entangling operations between qubits consistently is essential for the performance of multi-qubit syst... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: April 8
By Linda Christensen - 08 Apr, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=214 /] Find last week’s technical paper additions here. » read more

Hybrid All-Optical Switching Devices Combining Silicon Nanocavities And 2D Semiconductor Material
By Technical Paper Link - 02 Apr, 2024 - Comments: 0

A new technical paper titled "Hybrid silicon all-optical switching devices integrated with two-dimensional material" was published by researchers at RIKEN, National Institute of Advanced Industrial Science and Technology (AIST), and Keio University. Abstract "We propose and demonstrate hybrid all-optical switching devices that combine silicon nanocavities and two-dimensional semiconduct... » read more

Manufacturing Bits: Oct. 20
By Mark LaPedus - 20 Oct, 2020 - Comments: 1

Thermometers for 3D measurements The National Institute of Standards and Technology (NIST) is developing a nano-thermometer technology that could one day take 3D temperature measurements at the microscopic scale. The project, called Thermal Magnetic Imaging and Control (Thermal MagIC), hopes to develop tiny thermometers based on magnetic nanoparticles. These tiny thermometers could be injec... » read more

Manufacturing Bits: Aug. 18
By Mark LaPedus - 18 Aug, 2020 - Comments: 0

Quantum Internet The U.S. Department of Energy (DOE) recently unveiled a strategy to develop a quantum Internet in the United States. DOE’s 17 National Laboratories will serve as the backbone of the quantum Internet, which will rely on the laws of quantum mechanics to control and transmit information over a network. Currently in its initial stages of development, the quantum Internet coul... » read more

Power/Performance Bits: June 2
By Jesse Allen - 02 Jun, 2020 - Comments: 0

Neuromorphic memristor Researchers at the University of Massachusetts Amherst used protein nanowires to create neuromorphic memristors capable of running at extremely low voltage. A challenge to neuromorphic computing is mimicking the low voltage at which the brain operates: it sends signals between neurons at around 80 millivolts. Jun Yao, an electrical and computer engineering researcher at ... » read more

Power/Performance Bits: May 26
By Jesse Allen - 26 May, 2020 - Comments: 0

Warmer quantum computing Researchers at the University of New South Wales Sydney, Université de Sherbrooke, Aalto University, and Keio University developed a proof-of-concept quantum processor unit cell on a silicon chip that works at 1.5 Kelvin – 15 times warmer than current chip-based technology that uses superconducting qubits. "This is still very cold, but is a temperature that can b... » read more

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