The Essential Signal Generator Guide Building A Solid Foundation In RF — Part 1

By Keysight - 22 Jun, 2022 - Comments: 0

Eliminate uncertainties and doubts from your test results with a reliable signal source. Engineers designing consumer wireless, military communications, or radar devices face an ongoing bandwidth crunch in spectrum filled with interference. An accurate signal generator offers precise and stable test signals for characterizing your device under test (DUT). It also lets you apply impairments t... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Jun, 2022 - Comments: 0

Automotive, mobility U.S. National Highway Traffic Safety Administration (NHTSA) release its first crash reports from ADAS (advanced driver assistance systems, i.e., SAE Level 2) and ADS (automated driving systems, i.e., SAE Levels 3-5). The systems had to be in use at least 30 seconds before the crash in order for it to be reportable. The car may have had the system turned off at the time ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 10 Jun, 2022 - Comments: 0

Edge, embedded, IoT Renesas Electronics will acquire Reality Analytics, Inc. (Reality AI), a provider of embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial, and commercial products. The inference-based AI solutions can be implemented across various endpoint AI applications. “Customers are increasingly demanding highly customized solutions involving emb... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 10 Jun, 2022 - Comments: 0

Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

DRAM Thermal Issues Reach Crisis Point

By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

Keeping IC Packages Cool

By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Jun, 2022 - Comments: 0

Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

AI-Powered Verification

By Brian Bailey - 01 Jun, 2022 - Comments: 1

With functional verification consuming more time and effort than design, the chip industry is looking at every possible way to make the verification process more effective and more efficient. Artificial intelligence (AI) and machine learning (ML) are being tested to see how big an impact they can have. While there is progress, it still appears to be just touching the periphery of the problem... » read more

Week In Review: Design, Low Power

By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Evolving Your ADAS And AV Tests With Emulation Capability

By Keysight - 25 May, 2022 - Comments: 0

Creating safe and robust autonomous driving (AD) systems is a complex task. Autonomous vehicles (AVs) have hundreds of sensors, all of which need to work with one another inside the car and with other smart vehicles. The software algorithms enabling autonomous driving features will ultimately need to synthesize all the information collected from these sensors to ensure that the vehicle responds... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Keysight Technologies

The Essential Signal Generator Guide Building A Solid Foundation In RF — Part 1

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

DRAM Thermal Issues Reach Crisis Point

Keeping IC Packages Cool

Week In Review: Design, Low Power

AI-Powered Verification

Week In Review: Design, Low Power

Evolving Your ADAS And AV Tests With Emulation Capability