tag: King Abdullah University of Science and Technology

Research Bits: July 18
By Jesse Allen - 18 Jul, 2023 - Comments: 0

Miniaturized ferroelectric FETs Researchers from the University of Pennsylvania, Hanyang University, King Abdulaziz University, King Abdullah University of Science and Technology, and University of Tokyo proposed a new ferroelectric FET (FE-FET) design with improved performance for both computing and memory. The transistor layers the two-dimensional semiconductor molybdenum disulfide (MoS2)... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 09 Jun, 2023 - Comments: 0

The European Union’s Chips Act Commission has approved €8.1 billion ($8.73 billion) in funding for an Important Project of Common European Interest (IPCEI). As part of this IPCEI, 56 companies, including small and medium-sized enterprises (‘SMEs') and start-ups, will undertake 68 projects in research, innovation, and deployment of microelectronics and communication technologies across th... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 31 Mar, 2023 - Comments: 0

The U.S. Commerce Department outlined proposed rules for the Chips for America Incentives Program, including additional details on national security measures applicable to the CHIPS Incentives Program included in the CHIPS and Science Act. The rules limit funding recipients from investing in the expansion of semiconductor manufacturing in foreign countries of concern, notably the People’s Rep... » read more

2D-Materials-Based Electronic Circuits (KAUST and TSMC)
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A special edition article titled "Electronic Circuits made of 2D Materials" was just published by Dr. Mario Lanza, KAUST Associate Professor of Material Science and Engineering, and Iuliana Radu, corporate researcher at TSMC. This special issue covers 21 articles from leading subject matter experts, ranging from materials synthesis and their integration in micro/nano-electronic devices and c... » read more

Power/Performance Bits: Feb. 15
By Jesse Allen - 15 Feb, 2022 - Comments: 0

3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Power/Performance Bits: Dec. 28
By Jesse Allen - 28 Dec, 2021 - Comments: 0

Shrinking LEDs Researchers from King Abdullah University of Science and Technology (KAUST) are working to make LEDs smaller. Micrometer-scale light-emitting diodes (μLEDs) could be an ideal building block for future microLED displays, but devices based on nitride-based alloys used to achieve a broad color range become poor emitters of light when shrunk to micrometer scales. “The main ... » read more

Power/Performance Bits: Nov. 16
By Jesse Allen - 16 Nov, 2021 - Comments: 0

Light-emitting memory Researchers from Kyushu University and National Taiwan Normal University propose a 'light-emitting memory' based on a perovskite that can simultaneously store and visually transmit data. The team used the idea in conjunction with resistive RAM (RRAM), in which states of high and low resistance represent ones and zeros. "The electrical measurements needed to check the r... » read more

Standards for the Characterization of Endurance in Resistive Switching Devices
By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract "Resistive switching (RS) devices are emerging electronic components that could have applications in multiple types of integrated circuits, including electronic memories, true random number generators, radiofrequency switches, neuromorphic vision sensors, and artificial neural networks. The main factor hindering the massive employment of RS devices in commercial circuits is related to... » read more

Power/Performance Bits: Oct. 11
By Jesse Allen - 11 Oct, 2021 - Comments: 0

Finer printed circuits Researchers from the National Institute for Materials Science in Japan, Jiangnan University, Zhengzhou University, Senju Metal Industry Co., and C-INK Co. developed a way to print smaller features for printed electronics. The directed self-assembly method increases the chemical polarity of predetermined areas on a surface, which promoted selective adhesion of metallic na... » read more

Power/Performance Bits: Aug. 17
By Jesse Allen - 17 Aug, 2021 - Comments: 0

Digital fiber Researchers at MIT, Harrisburg University of Science and Technology, and Rhode Island School of Design developed a digital fiber that can sense, store, analyze, and infer activity after being sewn into a shirt. "This work presents the first realization of a fabric with the ability to store and process data digitally, adding a new information content dimension to textiles and a... » read more

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