Better Inspection, Higher Yield


Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different machines with different capital and operating costs, and they might look like competing approaches with different economic returns. In fact, they are complementary tactics that can be balanced within an ... » read more

Recovery In Flat-Panel Display Biz


The flat-panel display market is starting to recover after a period of oversupply and lackluster growth, fueled by new technologies as well as more people working from home. The flat-panel display market is complex. Several different technologies are at play, such as liquid-crystal displays (LCDs) for TV screens and other products, as well as organic light-emitting diodes (OLEDs) for smartph... » read more

Finding Defects With E-Beam Inspection


Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more

Better Analytics Needed For Assembly


Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

Auto Chip Reliability Opens Door To Other Industries


Digital chips in the semiconductor industry evolve from each other. Ideas flow into each other over the years, with occasional big leaps in evolution. The term ‘evolution’ fits because one chip evolves to perfectly optimized for one industry niche. But what happens when one industry’s chip becomes a useful for other industries because it is more cost-effective than what is being used i... » read more

Week In Review: Manufacturing, Test


Chipmakers Nvidia is in advanced talks to acquire Arm from Softbank, according to numerous reports. In addition, TSMC and Foxconn are looking at possible investments or stakes in Arm, according to a report from Nikkei Asia Review. Infineon posted mixed results for the third quarter of the 2020 fiscal year. "Infineon has so far coped well with the challenging situation caused by the coronavi... » read more

Week In Review: Manufacturing, Test


Semicon recap The virtual version of Semicon West took place this week. Virtual events have their places. It’s no substitute for an in-person event. Nonetheless, the virtual version of Semicon West is still a place to get an update on the latest equipment, test and packaging technologies. It is also interesting to visit the virtual booths. It’s a fast way to meet people. I chatted with ... » read more

The Race To Much More Advanced Packaging


Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Semicon West Day One/Two


For years, the semiconductor and equipment industry has congregated at the annual Semicon West trade show in San Francisco. It’s an event to get an update on the latest equipment, test and packaging technologies. It’s also a good way to meet with people who you haven’t seen in a year, if not longer. It’s a great way to get a pulse on the industry. Needless to say, Semicon is a vir... » read more

Time To Watch China’s Equipment Efforts


For years, China has been developing its own semiconductor equipment and materials industry. The goal has been to reduce its dependence on foreign equipment and material vendors. Some China-based equipment vendors have made their presence felt. But overall, China’s equipment companies have barely made a dent in the market. Hardly anyone has been paying attention to China’s equipment ... » read more

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