tag: Kyocera

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 16 Aug, 2019 - Comments: 0

Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 May, 2019 - Comments: 0

Trade wars The trade war between the United States and China is escalating and it is here to stay. Victor Davis Hanson, a senior fellow at think tank Hoover Institution, said the United States is at a crossroads with China. It could define America’s security and the international order for decades to come. Here’s the latest blog on trade tensions between the U.S. and China. “Tensions ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Apr, 2019 - Comments: 0

Fab tools ASML said it has disagreed with any implication that it has been a victim of “Chinese espionage,” as stated in an article in a Dutch newspaper. The article discusses the results of a public court case in the United States that ASML won last year. In the case, XTAL was found by a jury to have misappropriated ASML’s confidential and proprietary information as well as trade secret... » read more

Choosing The Right Interconnect
By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Mar, 2018 - Comments: 0

Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Dec, 2017 - Comments: 0

Chipmakers The 2017 top-ten rankings of foundries remain the same as last year, according to TrendForce. TSMC, GlobalFoundries and United Microelectronics Corp. (UMC) rank first, second, and third, respectively, in terms of projected sales in 2017, according to TrendForce. TSMC has a dominant market share of 55.9%. In the rankings, Samsung is in fourth place, followed in order by SMIC, TowerJa... » read more

The Week In Review: Design
By Jesse Allen - 30 Jun, 2017 - Comments: 0

Tools Mentor released new software for automated set-up of PCB DFT rules. The tool extracts relevant PCB design technology from the design data to determine the correct PCB technology classification, then maps the PCB classification to the constraints associated with the applicable manufacturing processes to run only the checks necessary for the design. IP Synopsys improved the convolu... » read more

The Week In Review: Design
By Jesse Allen - 16 Sep, 2016 - Comments: 0

IP Sonics unveiled Energy Processing Unit (EPU) IP, based on the company's ICE-Grain power architecture, to better manage and control circuit idle time. The IP facilitates design of SoC power architecture and implementation and verification of the resulting power management subsystem. Synopsys debuted ARC SEM security processors with timing and power randomization features to protect agai... » read more

Better Software. Faster! A Virtual Prototyping Case Study From Kyocera Document Solutions
By Tom De Schutter - 26 Feb, 2015 - Comments: 0

From time to time I like to use this blog to provide you with an update about the "Better Software. Faster!" book that illustrates the best practices in virtual prototyping. This time, I am happy to announce that Mamoru Kani-san, senior manager, R&D department 22, software 2 R&D division of the corporate software development division of Kyocera Document Solutions, wrote a new case study... » read more

The Week In Review: Design/IoT
By Ed Sperling - 06 Nov, 2014 - Comments: 0

Chips NXP rolled out what it claims are the most power-efficient microcontrollers for always-on applications. The minimum draw is 3 microamps for continuous sensor listening. Tools Mentor Graphics beefed up its CFD tool, adding thermo-fluid analysis simulation capabilities for automotive, aerospace and industrial applications. Included is support for FMI, an open-source environment that al... » read more

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