Gearing Up For Level 4 Vehicles


More autonomous features are being added into high-end vehicles, but getting to full autonomy will likely take years more effort, a slew of new technologies — some of which are not in use today, and some of which involve infrastructure outside the vehicle — along with sufficient volume to bring the cost of these combined capabilities down to an affordable price point. In the meantime, ma... » read more

Navigating The Intersection Of Safety And Security


Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. These electronic systems communicated primarily through legacy bus interconnect protocols, like controller... » read more

SOT-MRAM To Challenge SRAM


In an era of new non-volatile memory (NVM) technologies, yet another variation is poised to join the competition — a new version of MRAM called spin-orbit torque, or SOT-MRAM. What makes this one particularly interesting is the possibility that someday it could supplant SRAM arrays in systems-on-chip (SoCs) and other integrated circuits. The key advantages of SOT-MRAM technology are the pr... » read more

How To Build An Automotive Chip


The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

Executive Insight: Sehat Sutardja


Sehat Sutardja, chairman and CEO of Marvell, sat down with Semiconductor Engineering to talk about new approaches for design and memory and why costs and time to market are forcing changes in Moore's Law. What follows are excerpts of that conversation. SE: What was behind your move into modular packaging? Sutardja: The cost of building chips is getting out of hand. As we make things more ... » read more