tag: Lam Research

Week In Review: Semiconductor Manufacturing & Test
By Gregory Haley - 17 Feb, 2023 - Comments: 0

The Biden Administration’s export bans for semiconductor manufacturing equipment are delaying expansion plans for Chinese chipmakers, Nikkei Asia reports. Yangtze Memory Technologies (YMTC) has halted work on its second memory plant near Wuhan, and ChangXin Memory Technologies (CMTX) says its second production facility, slated to open in 2023, will be delayed until 2024 or 2025. In an effo... » read more

Devices And Transistors For The Next 75 Years
By Laura Peters - 16 Feb, 2023 - Comments: 0

The 75th anniversary of the invention of the transistor sparked a lively panel discussion at IEDM, spurring debate about the future of CMOS, the role of III-V and 2D materials in future transistors, and what will be the next great memory architecture.[1] Industry veterans from the memory, logic, and research communities see high-NA EUV production, NAND flash with 1,000 layers, and hybrid bon... » read more

The Other Side Of The Wafer: The Latest Developments In Backside Power Delivery
By Sandy Wen - 16 Feb, 2023 - Comments: 0

At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade during a wafer transfer. After cleaning up the mess, we remembered that a variety of thin films could be deposited on the wafer backside, which could decrease its friction coefficient. Slowing down the wa... » read more

As Chiplets Go Mainstream, Chip Industry Players Collaborate to Overcome New Development Challenges
By Ashley Huang - 16 Feb, 2023 - Comments: 0

The semiconductor industry is building a comprehensive chiplet ecosystem to seize on the advantages of the devices over traditional monolithic system-on-chips (SoCs) such as improved performance, lower power consumption, and greater design flexibility. With heterogeneous integration (HI) presenting significant challenges, collaboration to fulfill the potential of chiplets has become even more i... » read more

Blog Review: Feb. 8
By Jesse Allen - 08 Feb, 2023 - Comments: 0

Cadence's Sanjeet Kumar points to key changes and optimizations that are done for USB3 Gen T compared to USB3 Gen X tunneling in order to minimize tunnel overhead and maximize USB3 throughput. Siemens EDA's Harry Foster considers the effectiveness of IC and ASIC verification by looking at schedule overruns, number of required spins, and classification of functional bugs. Synopsys' Chris C... » read more

Big Changes Ahead For Chip Technology And Industry Dynamics
By Ed Sperling - 08 Feb, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of customization and advanced packaging, and concerns about reliability and geopolitical rivalries with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computational products at Lam Research; and Ankur Gupta, vice president and general manager of the test group and lifecycle s... » read more

Chip Industry’s Earnings Roundup
By Linda Christensen - 06 Feb, 2023 - Comments: 0

Editor's Note: Updated throughout February 2023 for additional earnings releases. Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for consumer electronics softened due to inflation, rising interest rates, and post-pandemic market saturation, creating a slump in the memory chip ... » read more

Collaboration Widens Among Big Chip Companies
By Ed Sperling - 23 Jan, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the growing need for collaboration among equipment and tools vendors, the impact of systems companies and increases in complexity, and how to handle a push for more customization while controlling costs, with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computati... » read more

Blog Review: Jan. 18
By Jesse Allen - 18 Jan, 2023 - Comments: 0

Synopsys' Dana Neustadter, Sara Zafar Jafarzadeh, and Ruud Derwig argue that we are already at an inflection point for post-quantum security because devices and infrastructure systems with longer life cycles or communicating data that must be kept confidential for an extended period need to have a path towards quantum-safe solutions. Siemens EDA's Harry Foster looks at trends in adoption of ... » read more

Metrology Options Increase As Device Needs Shift
By Laura Peters - 10 Jan, 2023 - Comments: 1

Semiconductor fabs are taking an ‘all hands on deck’ approach to solving tough metrology and yield management challenges, combining tools, processes, and other technologies as the chip industry transitions to nanosheet transistors on the front end and heterogenous integration on the back end. Optical and e-beam tools are being extended, while X-ray inspection is being added on a case-by-... » read more

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