tag: Lam Research

What Happened To 450mm?
By The SE Staff - 17 Jul, 2014 - Comments: 1

By Mark LaPedus, Ed Sperling & Katherine Derbyshire There was a time not very long ago—one process node, in fact—when the economic momentum of Moore’s Law seemed unstoppable with a combination of extreme ultraviolet lithography, larger wafer sizes and a variety of new materials. Shrinking feature sizes is still technically possible, but certainly not with the same promised economic benef... » read more

Mid-Year Market Review: A Tale Of Two Halves
By Jim Feldhan - 17 Jul, 2014 - Comments: 0

The month of July brings 110-degree weather to Phoenix and a welcome trip to San Francisco for Semicon West. It also means the year is half over and it’s time to assess mid-year market dynamics. Spirits were high last week at Semicon West. Most equipment vendors made significant revenue gains in the first half of 2014 and expect the second half of the year to be just as good or even bette... » read more

Will 7nm And 5nm Really Happen?
By Mark LaPedus - 14 Jul, 2014 - Comments: 2

Today’s silicon-based finFETs could run out of steam at 10nm. If or when chipmakers move beyond 10nm, IC vendors will require a new transistor architecture. III-V finFETs, gate-all-around FETs, quantum well finFETs, SOI finFETs and vertical nanowires are just a few of the future transistor candidates at 7nm and 5nm. Technically, it’s possible to manufacture the transistor portions of the... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

What Comes Next?
By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

Will 7nm And 5nm Really Happen?
By Mark LaPedus - 19 Jun, 2014 - Comments: 11

As leading-edge chipmakers continue to ramp up their 28nm and 20nm devices, vendors are also updating their future technology roadmaps. In fact, IC makers are talking about their new shipment schedules for 10nm. And GlobalFoundries, Intel, Samsung and TSMC are narrowing down the options for 7nm, 5nm and beyond. There is a high probability that IC makers can scale to 10nm, but vendors face a ... » read more

Atomic Layer Etch Finally Emerges
By Mark LaPedus - 15 May, 2014 - Comments: 1

The migration towards finFETs and other devices at the 20nm node and beyond will require a new array of chip-manufacturing technologies. Multiple patterning, hybrid metrology and newfangled interconnect schemes are just a few of the technologies required for future scaling. In addition, the industry also will require new techniques that can process structures at the atomic level. For example... » read more

The Bumpy Road To FinFETs
By Mark LaPedus - 15 May, 2014 - Comments: 2

The shift from planar transistors to finFETs is a major inflection point in the IC industry. FinFETs are expected to enable higher performance chips at lower voltages. And the next-generation transistor technology also could allow the industry to extend CMOS to the 10nm node and perhaps beyond. But as it turns out, finFET technology is also harder to master than previously thought. For exam... » read more

Executive Insight: CH Wu
By Ed Sperling - 21 Apr, 2014 - Comments: 0

Semiconductor Engineering sat down with CH Wu, president and CEO of Advantest Taiwan, to talk about business, politics, and his philosophy on what really motivates people. What follows are excerpts of that conversation. SE: Tell us a little about who you are and your background. Wu: I graduated from college with a degree in electrical engineering and started at Philips Electric, then moved ... » read more

Applied-TEL Watch
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

By Mark LaPedus So far this year, the biggest story in the fab tool industry is fairly obvious—Applied Materials recently signed a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) for about $9.3 billion. The blockbuster announcement will likely be the top story of 2013. Of course, the integration of Applied and TEL will be a challenge. In any case, the Applied-TEL deal is i... » read more

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