The Week In Review: Design


Tools & IP Cadence and National Instruments are teaming up with the aim of improving the semiconductor development and test process. The two companies are jointly working on common transistor models to ensure consistent simulation behavior between NI AWR Microwave Office circuit design software and the Cadence Spectre simulation platform. Cadence also launched the Virtuoso RF Solution for ... » read more

The Week In Review: Manufacturing


Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

China’s Ambitious Automotive Plans


China has big plans for cars—and other related markets. After years of trailing behind Japanese, European and U.S.-based carmakers in automotive technology, reliability, status, and even market share within its own political borders, the country is making a concerted push into internally developed and manufactured assisted- and self-driving vehicles. The strategy plays out well for China o... » read more

The Week In Review: Manufacturing


Chipmakers Toshiba has changed its mind yet again about which group will buy its prized memory unit. On June 20, Toshiba chose a Japanese government-led consortium of INCJ/DBJ, Bain Capital and South Korea’s SK Hynix. Then, Toshiba changed its mind and selected a similar group with Western Digital (WDC), leaving SK Hynix on the outside looking in. This week, Toshiba signed a deal with a ... » read more

The Week In Review: Manufacturing


Fab tools In a move to expand its product portfolio, Lam Research has acquired Coventor, a provider of simulation and modeling solutions for the semiconductor and MEMS industries. Lam Research held an analyst event at the recent Flash Memory Summit. The topics included 3D NAND and other technologies. In a blog, here’s what executives from Lam said at the event. Analysts from RBC Cap... » read more

The Week In Review: Manufacturing


Chipmakers The situation between Toshiba and its fab partner, Western Digital (WD), has gone from bad to worse. As reported, troubled Toshiba recently selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. WD attempted but failed to buy the unit, an... » read more

The Week In Review: Design


M&A Invecas will acquire Lattice Semiconductor's HDMI design team and Simplay Labs subsidiary, which oversees standards compliance and interoperability testing services. Invecas supplies foundation, analog, and interface IP optimized for GlobalFoundries processes. The deal is expected to close later this month. Last year, Lattice announced it would be acquired by Chinese private equity fir... » read more

The Week In Review: Manufacturing


SPIE news At this week’s SPIE Advanced Lithography conference, the industry paid close attention to the progress of extreme ultraviolet (EUV) lithography. Here’s the general report card: EUV is making noticeable progress, but there are still some challenges ahead, such as the power source, resists and pellicles. Several issues need to be resolved before chipmakers can put EUV into mass... » read more

CPU, GPU, or FPGA?


Nvidia’s new GeForce GTX 1080 gaming graphics card is a piece of work. Employing the company’s Pascal architecture and featuring chips made with a 16nm [getkc id="185" kc_name="finFET"] process, the GTX 1080’s GP104 graphics processing units boast 7.2 billion transistors, running at 1.6 GHz, and it can be overclocked to 1.733 GHz. The die size is 314 mm², 21% smaller than its GeForce ... » read more

The Week In Review: Manufacturing


In case you missed it, Apple rolled out its latest iPhones and other products. The latest iPhone 6 is using chips based on finFETs. So, who won Apple’s application processor foundry business for the iPhone 7? “In our foundry checks, it appears Apple is likely splitting the 14/16nm business for the recent product launches between TSMC and Samsung. We suspect Samsung’s 14nm is used for the ... » read more

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