Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 19 May, 2023 - Comments: 0

Former Apple engineer Weibao Wang was indicted for stealing Apple’s autonomous vehicle hardware and software IP and giving the information to Chinese competitors. Among other items, authorities said they found source code for the project on the engineer’s personal laptop, which was seized at his home. Wang fled to China the same day a search warrant was executed. This is one of five cases b... » read more

Research Bits: Jan. 31

By Susan Rambo - 31 Jan, 2023 - Comments: 0

The power of proximity Researchers from Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab), Stanford, and University of California Berkeley have observed that electrons transfer heat rapidly between layers of the 2D semiconductor materials tungsten diselenide (WSe2) and tungsten disulfide (WS2). The electrons acted as a bridge between the two materials, the layers of... » read more

Research Bits: April 26

By Jesse Allen - 26 Apr, 2022 - Comments: 0

Photonic quantum computers Researchers from Stanford University propose a simpler design method for photonic quantum computers. The proposed design uses a laser to manipulate a single atom that, in turn, can modify the state of the photons via a phenomenon called “quantum teleportation.” The atom can be reset and reused for many quantum gates, eliminating the need to build multiple distinc... » read more

Technical Paper Round-Up: March 15

By Linda Christensen - 15 Mar, 2022 - Comments: 0

Research is expanding across a variety of semiconductor-related topics, from security to flexible substrates and chiplets. Unlike in the past, when work was confined to some of the largest universities, that research work is now being spread across a much broader spectrum of schools on a global basic, including joint research involving schools whose names rarely appeared together. Among the ... » read more

System Bits: March 27

By Ann Mutschler - 27 Mar, 2018 - Comments: 0

New quantum electronic material has atomic structure resembling a Japanese basketweaving pattern According to MIT, Harvard University, and Lawrence Berkeley National Laboratory researchers, a motif of Japanese basketweaving known as the kagome pattern has preoccupied physicists for decades. They reminded that kagome baskets are typically made from strips of bamboo woven into a highly symmetric... » read more

Materials For Future Electronics

By Katherine Derbyshire - 18 May, 2017 - Comments: 0

Examining the research underway in electronics materials provides a keyhole view into what may be possible in future electronics design. Although some of this research will not end up in commercial products, it does provide an indication of the kinds of problems that are being addressed, how they are being approached, and where the research dollars are being spent. Flexible electronics are a... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer