Ensuring Your Power And Ground Nets Are Correctly Connected

By Terry Meeks - 03 Jun, 2024 - Comments: 0

In most chip designs, the power and ground nets are likely your largest and most important nets. If any devices are not properly connected, then you cannot expect them to function as expected. Amongst the many problems that can occur to power and ground involves the connections to the well areas of your design that power all the bulk connections to your devices. Well regions connectivity is oft... » read more

Fast, Focused Early-Stage Circuit Verification Can Get You To Signoff Faster

By Kesmat Shahin - 23 Feb, 2023 - Comments: 0

Designers everywhere know that with the increasing complexity of integrated circuits (ICs), meeting tapeout schedules has become increasingly difficult. While there are often many reasons for missing tapeouts, one critical component is the significant amount of time needed to run the signoff layout verification cycle, which contributes to overall signoff process duration. Much of this schedule ... » read more

Meeting Today’s Challenges For LVS

By Manoz Palaparthi - 13 Oct, 2022 - Comments: 0

At least one thing is for certain in semiconductor development: bigger and more complex designs put lots of pressure on electronic design automation (EDA) tools and methodologies. Yesterday’s chip is today’s IP block, and entire racks of electronics are being packed into system-on-chip (SoC) devices. EDA tools must evolve constantly in order to keep pace with size and complexity while meeti... » read more

Improving Design Collaboration In The Age Of Remote Work

By Amit Varde - 13 Sep, 2022 - Comments: 0

Teams of analog and mixed signal (AMS) design and layout engineers spend countless hours extracting every ounce of performance out of their design. They continually make incremental changes daily to the design until the very end, as close to tape out as possible. Each change made to the design requires corresponding changes to the circuit layout. As technology advances, accounting for the paras... » read more

Optimize Physical Verification Cost Of Ownership

By Manoz Palaparthi - 29 Jul, 2021 - Comments: 0

As semiconductor designs continue to grow in size and complexity, they put increasing pressure on every stage of the design process. Physical verification, often on the critical path to tape-out, is especially affected. Design rule checking (DRC), layout versus schematic (LVS), and other physical verification runs take longer as chip size increases. In addition, finer geometries introduce new c... » read more

Innovative Strategies Are Improving Early Design Circuit Verification

By Raghav Katoch - 24 Sep, 2020 - Comments: 0

Layout vs. schematic (LVS) circuit verification is an essential stage in the integrated circuit (IC) design verification cycle. However, given today’s large design sizes, numerous hierarchies, and complex foundry decks, meeting planned tapeout deadlines in the quickest turnaround time (TAT) can be difficult. In an effort to minimize TAT, most design teams now use parallelized design flows, wh... » read more

Moving Beyond Geometries: Context-Aware Verification Improves Design Quality And Reliability

By Sherif Hany - 25 Apr, 2019 - Comments: 0

Context-aware checks integrate physical and electrical information to evaluate a wide range of design conditions, from advanced design rule compliance, to circuit and reliability verification, to design optimization and finishing. Automated context-aware checking provides designers with actionable results that improve both debugging efficiency and verification precision. Introduction Many p... » read more

Device Pin-Specific Property Extraction For Layout Simulation

By Phil Brooks - 18 Aug, 2016 - Comments: 0

As we work through the sub-20 nm design space, the interactions between and effects on devices that are near each other are becoming critical factors in achieving the desired electrical performance. Accurate extraction of device pin-specific properties for modelling these effects is essential to attaining design goals. LVS extraction challenges Layout vs. schematic (LVS) comparison tools prov... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.