Manufacturing Bits: Oct. 22

By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

The Race To Next-Gen 2.5D/3D Packages

By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

The Next New Memories

By Mark LaPedus - 15 Aug, 2019 - Comments: 2

Several next-generation memory types are ramping up after years of R&D, but there are still more new memories in the research pipeline. Today, several next-generation memories, such as MRAM, phase-change memory (PCM) and ReRAM, are shipping to one degree or another. Some of the next new memories are extensions of these technologies. Others are based on entirely new technologies or involve ar... » read more

Manufacturing Bits: July 10

By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

What’s Next In Advanced Packaging

By Mark LaPedus - 20 Jun, 2019 - Comments: 3

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

MicroLEDs: The Next Revolution In Displays?

By Mark LaPedus - 29 May, 2019 - Comments: 1

Flat-panel display technology is exploding on several fronts as more screens are required for more devices. But one type of display is generating an enormous amount of buzz in the market—microLEDs. Dozens of companies are working on micro-light emitting diodes (microLEDs), a technology that promises to provide better and brighter displays than current solutions in the market. Apple, Facebo... » read more

Partitioning In 3D

By Katherine Derbyshire - 23 May, 2019 - Comments: 2

The best way to improve transistor density isn't necessarily to cram more of them onto a single die. Moore’s Law in its original form stated that device density doubles about every two years while cost remains constant. It relied on the observation that the cost of a processed silicon wafer remained constant regardless of the number of devices printed on it, which in turn depended on litho... » read more

Lithography Options For Next-Gen Devices

By Mark LaPedus - 18 Apr, 2019 - Comments: 2

Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

In-Memory Computing Challenges Come Into Focus

By Katherine Derbyshire - 06 Feb, 2019 - Comments: 6

For the last several decades, gains in computing performance have come by processing larger volumes of data more quickly and with superior precision. Memory and storage space are measured in gigabytes and terabytes now, not kilobytes and megabytes. Processors operate on 64-bit rather than 8-bit chunks of data. And yet the semiconductor industry’s ability to create and collect high quality ... » read more

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