DSA Re-Enters Litho Picture

By Mark LaPedus - 15 Mar, 2018 - Comments: 1

By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

Manufacturing Bits: March 6

By Mark LaPedus - 06 Mar, 2018 - Comments: 0

Security ICs with multi-beam Leti, a research institute of CEA Tech, and Mapper Lithography have developed a new application for its multi-beam, direct-write lithography technology—security. In 2016, Mapper Lithography introduced the FLX-1200, a direct-write, multi-beam e-beam system. Using a 5-kV acceleration voltage, a beam generator creates an electron beam about 3cm in diameter. Then,... » read more

3D Neuromorphic Architectures

By Katherine Derbyshire - 11 Dec, 2017 - Comments: 1

Matrix multiplication is a critical operation in conventional neural networks. Each node of the network receives an input signal, multiplies it by some predetermined weight, and passes the result to the next layer of nodes. While the nature of the signal, the method used to determine the weights, and the desired result will all depend on the specific application, the computational task is simpl... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 08 Dec, 2017 - Comments: 0

Fab tools and test Four former employees at Applied Materials were charged by the U.S. for allegedly trying to steal the company’s own fab tool technology designs, according to a report from Bloomberg and others. The former employees were allegedly trying to sell the technology to a Chinese startup that would compete against Applied, according to the report. The former employees--Liang C... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 01 Dec, 2017 - Comments: 0

Chipmakers The 2017 top-ten rankings of foundries remain the same as last year, according to TrendForce. TSMC, GlobalFoundries and United Microelectronics Corp. (UMC) rank first, second, and third, respectively, in terms of projected sales in 2017, according to TrendForce. TSMC has a dominant market share of 55.9%. In the rankings, Samsung is in fourth place, followed in order by SMIC, TowerJa... » read more

Manufacturing Bits: Nov. 14

By Mark LaPedus - 14 Nov, 2017 - Comments: 0

GaN for electric cars Leti is coordinating a new European project to improve the drivetrain in electric vehicles. The so-called ModulED project will focus on the development of gallium nitride (GaN) technology for electric vehicles. The goal is to use power-based GaN devices for the motor, enabling a change from direct current to alternating current. The three-year, €7.2 million proje... » read more

Manufacturing Bits: Sept. 12

By Mark LaPedus - 12 Sep, 2017 - Comments: 0

Failure analysis for 2.5D/3D chips Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for light-induced capacitance alteration. It addresses the reliability issues for 2.5D/3D devices in a non-destructive and cost-effective manner at the wafer level. For s... » read more

Toward Defining Qubits

By Ed Sperling - 06 Sep, 2017 - Comments: 0

Quantum computing, by many accounts the future of high-performance computing, will be blazing fast, state-dependent, and it will require extremely cold operating temperatures. But beyond some general areas of agreement, comparing progress made by companies or different research groups is confusing. What's missing is a simple nomenclature to define some of the basic technology used in quantum... » read more

5 Takeaways From Semicon

By Mark LaPedus - 20 Jul, 2017 - Comments: 0

At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

Reworking Established Nodes

By Ed Sperling - 24 May, 2017 - Comments: 2

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void. As with all electronic devices, the focus is on cost-cutting. But because these markets are likely ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

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3.5D: The Great Compromise

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Leti

DSA Re-Enters Litho Picture

Manufacturing Bits: March 6

3D Neuromorphic Architectures

The Week In Review: Manufacturing

The Week In Review: Manufacturing

Manufacturing Bits: Nov. 14

Manufacturing Bits: Sept. 12

Toward Defining Qubits

5 Takeaways From Semicon

Reworking Established Nodes