Tightening Margins On Heat


Stephen Crosher, CEO of Moortec, talks with Semiconductor Engineering about the impact of more accurate measurements on power, performance and reliability of designs from 40nm all the way down to 3nm. https://youtu.be/VnX-TiaMVmI » read more

Edge Inferencing Challenges


Geoff Tate, CEO of Flex Logix, talks about balancing different variables to improve performance and reduce power at the lowest cost possible in order to do inferencing in edge devices. https://youtu.be/1BTxwew--5U » read more

How to Make Sure IP will Float in the Rough SoC Sea


Today a typical SoC includes hundreds of instances of IP modules both digital and analog. These IPs are typically verified individually by the vendors. The burden of guaranteeing functionality when placed in the midst of a monster SoC is typically left to the SoC owner. With increasing frequencies, tighter margins, denser integrated circuits, new devices and materials, the task of verifying So... » read more

Making Sense Of DRAM


Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Week In Review: Design, Low Power


RISC-V Western Digital announced big plans for RISC-V with a new open source RISC-V core, an open standard initiative for cache coherent memory over a network, and an open source RISC-V instruction set simulator. The SweRV Core features a 2-way superscalar design with a 32-bit, 9 stage pipeline core. It has clock speeds of up to 1.8Ghz on a 28mm CMOS process technology and will be used in vari... » read more

Week In Review: Design, Low Power


Tools & IP UltraSoC debuted functional safety-focused Lockstep Monitor, a set of configurable IP blocks that are protocol aware and can be used to cross-check outputs, bus transactions, code execution, and register states between two or more redundant systems. It supports all common lockstep / redundancy architectures, including full dual-redundant lockstep, split/lock, master/checker, and... » read more

Looking Beyond The CPU


CPUs no longer deliver the same kind of of performance improvements as in the past, raising questions across the industry about what comes next. The growth in processing power delivered by a single CPU core began stalling out at the beginning of the decade, when power-related issues such as heat and noise forced processor companies to add more cores rather than pushing up the clock frequency... » read more

Process Corner Explosion


The number of corners that need to be checked is exploding at 7nm and below, fueled by everything from temperature and voltage to changes in metal. Lowering risk and increasing predictability of an SoC at those nodes starts with understanding what will happen when a design is manufactured on a particular foundry process, captured in process corners. This is basically a way of modeling what i... » read more

UPF-Aware Clock-Domain Crossing


Synopsys’ Namit Gupta talks with Semiconductor Engineering about low-power design techniques at the most advanced process nodes, including how to verify the impact of CDC on power at the register transfer level, how to avoid bugs caused by the post-RTL insertion of low-power devices such as isolation, retention and level shifters. https://youtu.be/HwRe9DHLfmg » read more

Baum: Finding SoC Power Flaws


A South Korean startup founded by a Samsung engineer-turned-researcher has created a tool that finds power design flaws early in the SoC design process. The startup, Baum, Inc., launched the second version of its power-modeling solution in June at DAC. The product is a power design-verification tool that uses high-level models to create analyses designed to spot design flaws that could creat... » read more

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