Machine Learning Inferencing Moves To Mobile Devices

By Kevin Fogarty - 02 Jul, 2019 - Comments: 0

It may sound retro for a developer with access to hyperscale data centers to discuss apps that can be measured in kilobytes, but the emphasis increasingly is on small, highly capable devices. In fact, Google staff research engineer Pete Warden points to a new app that uses less than 100 kilobytes for RAM and storage, creates an inference model smaller than 20KB, and which is capable of proce... » read more

Inferencing At The Edge

By Ed Sperling - 04 Jun, 2019 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about the challenges of power and performance at the edge, why this market is so important from a business and technology standpoint, and what factors need to be balanced. » read more

Week In Review: Design, Low Power

By Jesse Allen - 31 May, 2019 - Comments: 0

M&A NXP will acquire Marvell's Wi-Fi Connectivity business in an all-cash, asset transaction valued at $1.76 billion. The deal includes the Wi-Fi and Bluetooth technology portfolios and related assets; the business employs approximately 550 people worldwide. The deal is expected to close by calendar Q1 2020. Tools Cadence unveiled a data center-optimized FPGA-based prototyping system, ... » read more

Shift-Left Low Power Verification With UPF Information Model

By Himanshu Bhatt - 30 May, 2019 - Comments: 0

By Himanshu Bhatt, Shreedhar Ramachandra and Narayanan Ganesan Low power testbenches today have no visibility of the UPF objects and their states during a low power simulation. This has been one of the factors limiting the users from writing re-usable low power testbenches that can monitor the UPF objects and react to the state changes of UPF objects. To meet this requirement for the user to... » read more

ASIC/IC Trends With A Focus On Factors Of Silicon Success

By Harry Foster - 09 May, 2019 - Comments: 0

“The more you know, the more you know you don't know.” ― Aristotle, 4th C. BC When Aristotle uttered this humble aphorism, he wasn’t telling us to throw up our hands and not bother with learning. He was encouraging us to continue digging deeper, to get answers and ask questions of those answers — that the thrills and rewards of study are truly without end. This is a big part of ou... » read more

Week In Review: Design, Low Power

By Jesse Allen - 19 Apr, 2019 - Comments: 0

Intel acquired vision and video FPGA IP company Omnitek. Founded in 1998, the Basingstoke, England-based company has produced FPGA IP cores for video processing including conversion and enhancement, creating arbitrary image warps on a real time video stream, connectivity, and deep learning and AI inferencing. Terms of the deal were not disclosed. Qualcomm and Apple have dropped all litigatio... » read more

Target: 50% Reduction In Memory Power

By Brian Bailey - 11 Apr, 2019 - Comments: 3

Memory consumes about 50% or more of the area and about 50% of the power of an SoC, and those percentages are likely to increase. The problem is that static random access memory (SRAM) has not scaled in accordance with Moore's Law, and that will not change. In addition, with many devices not chasing the latest node and with power becoming an increasing concern, the industry must find ways to... » read more

Week In Review: Design, Low Power

By Jesse Allen - 22 Mar, 2019 - Comments: 0

Synopsys announced several new products: a new test family, a physical verification solution, and a software library for neural net SoCs. TestMAX, the new family of test products, includes soft error analysis and X-tolerant logic BIST for automotive test and functional safety requirements. TestMAX enables test through functional high-speed interfaces and supports early validation of DFT logi... » read more

Week In Review: Design, Low Power

By Jesse Allen - 08 Mar, 2019 - Comments: 0

Cadence debuted Denali Gen2 IP for LPDDR5/4/4X in TSMC's 7nm FinFET process technology. The offering consists of PHY, controller and Verification IP. It supports both the pre-release LPDDR5 standard and LPDDR4/4X devices as well as Arm AMBA AXI buses and reliability features like in-line error correcting codes. The LPDDR5 standard provides up to 1.5x bandwidth over LPDDR4 and LPDDR4X. The US... » read more

Week in Review: Design, Low Power

By Susan Rambo - 08 Feb, 2019 - Comments: 0

The U.S. Department of Energy (DOE) has awarded $35 million for 12 projects involving ultra-efficient power management. Called Arpa-E, the program encouraged participants to use medium-voltage electricity in new ways with real-world applications, such as industry, transportation and the grid. The top two award winners were Eaton Corp. (Arden, NC) for its DC wide-bandgap static circuit breaker, ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: low power

Machine Learning Inferencing Moves To Mobile Devices

Inferencing At The Edge

Week In Review: Design, Low Power

Shift-Left Low Power Verification With UPF Information Model

ASIC/IC Trends With A Focus On Factors Of Silicon Success

Week In Review: Design, Low Power

Target: 50% Reduction In Memory Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week in Review: Design, Low Power

Trending Articles

NAND Flash Targets 1,000 Layers

Testing For Thermal Issues Becomes More Difficult

Auto Chip Aging Accelerates In Hot Climates

Is In-Memory Compute Still Alive?

Top-Down Vs. Bottom-Up Chiplet Design

Knowledge Centers
Entities, people and technologies explored