Technical Paper Roundup: November 14

By Liz Allan - 14 Nov, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=165 /] More Reading Technical Paper Library home » read more

Chip Industry Week In Review

By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

A Survey Of Recent Advances And Research Activities In Wireless NoC Security

By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “Wireless Network-on-Chip Security Review: Attack Taxonomy, Implications, and Countermeasures” was published by researchers at Macquarie University (Sydney). Abstract: "Network-on-chip (NoC) is a critical on-chip communication framework that underpins high-performance multicore computing and network system architectures. Its adoption has become widespread due to t... » read more

System Bits: April 23

By Jeff Dorsch - 23 Apr, 2019 - Comments: 0

AI tool can clean up dirty data Researchers at the University of Waterloo, collaborating with colleagues at the University of Wisconsin and Stanford University, came up with HoloClean, an artificial intelligence tool to comb through dirty data and to detect information errors. “More and more machines are making decisions for us, so all our lives are touched by dirty data daily,” said Ih... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Macquarie University

Technical Paper Roundup: November 14

Chip Industry Week In Review

A Survey Of Recent Advances And Research Activities In Wireless NoC Security

System Bits: April 23

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers
Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

Why Small Fab And Assembly Houses Are Thriving

Sponsors

Recent Comments

About

Navigation

Connect With Us

tag: Macquarie University

Technical Paper Roundup: November 14

Chip Industry Week In Review

A Survey Of Recent Advances And Research Activities In Wireless NoC Security

System Bits: April 23

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

Why Small Fab And Assembly Houses Are Thriving

Sponsors

Newsletter Signup

Popular Tags

Recent Comments

About

Navigation

Connect With Us

Knowledge Centers
Entities, people and technologies explored