Big Changes Ahead For Photomask Technology

By Gregory Haley - 19 Oct, 2023 - Comments: 0

The move to curvilinear shapes on photomasks is gaining steam after years of promise as a way of improving yield, lowering defectivity, and reducing wasted space on a die — all of which are essential for both continued scaling and improved reliability in semiconductors. Interest in this approach ran high at this year's SPIE Photomask Technology + EUV Lithography Conference. Put simply, cur... » read more

Why Changes In Computing Are Driving Changes In Photomasks

By Ed Sperling - 18 Oct, 2022 - Comments: 0

Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about massive improvements in computation based upon increased density on chips, and why printing Manhattan shapes on a photomask are no longer sufficient to print high-performance devices with predictable reliability every time. He explains why a discontinuity in EDA physical design has opened the door for printing curvilinear shap... » read more

Unsolved Issues In Next-Gen Photomasks

By Mark LaPedus - 17 Feb, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

Mask Modeling In The EUV Era

By Ryan Pearman - 20 Jul, 2017 - Comments: 0

D2S reviews the challenges of mask modeling in the EUV era, including the need for dose/shape separation and mid-range correction, and the impact of GPU acceleration. https://youtu.be/iVqkoVMbK4o » read more

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tag: Manhattan shapes

Big Changes Ahead For Photomask Technology

Why Changes In Computing Are Driving Changes In Photomasks

Unsolved Issues In Next-Gen Photomasks

Mask Modeling In The EUV Era

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