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A Study Of Wiggling AA Modeling And Its Impact On Device Performance In Advanced DRAM


In this paper, a wiggling active area (fin) in an advanced 1x DRAM process was analyzed and modeled using the pattern-dependent etch simulation capabilities of the SEMulator3D semiconductor modeling software. Nonuniformity in sidewall passivation caused by hard mask pattern density loading was identified as the root cause of the wiggling profile. The calibrated model mimicked these phenomena, g... » read more

Power/Performance Bits: Oct. 29


Chip scanning Researchers at the University of Southern California and the Paul Scherer Institut in Switzerland developed an x-ray technique to non-destructively scan chips to make sure they conform to specifications. Such a system could be used to identify manufacturing defects or malicious alterations, the team said. Called ptychographic x-ray laminography, the technique utilizes x-rays f... » read more