Drive, Fix, Park

By Alex Tan - 05 Nov, 2015 - Comments: 0

Autonomous cars are coming. So are cars that can fix themselves. And this is just the beginning. The idea of a connected car is all about making data available, both within the car and with the external world. Car manufacturers will be able to improve automobile quality by getting real-time data from individual vehicles and providing corrective updates when problems are identified. In additi... » read more

More Choices, Less Certainty

By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

The Week In Review: Design/IoT

By Jesse Allen - 23 Oct, 2015 - Comments: 0

M&A ARM acquired Carbon Design Systems and its staff for an undisclosed sum, adding virtual prototyping capabilities for ARM cores. In 2008, ARM sold Carbon the tools it acquired in the 2004 purchase of virtual prototype development company AXYS Design Automation. Tools Mentor Graphics updated its PADS software, adding 3D tool capabilities to provide visualization, placement, and d... » read more

Security In 2.5D

By Ed Sperling - 12 Oct, 2015 - Comments: 2

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

The Challenge Of Updating Cars

By Ann Mutschler - 08 Oct, 2015 - Comments: 0

News stories about automotive hacking are becoming more common, and so is the concern about how to curb this problem. Security has become a new layer of system design complexity, and it's being taken increasingly seriously in a market that until very recently largely ignored it. That attitude is changing rapidly though, particularly with the advent of autonomous and connected vehicles. Secu... » read more

Rolling Out Automotive Security

By Ann Mutschler - 08 Oct, 2015 - Comments: 0

The automotive world has traditionally been a secretive place as automakers made it their mission to hold design plans as close to their vests as possible. With complexity in the automotive design process, that tradition has been changing as automakers work ever more closely with their ecosystem. In one example, Adam Sherer, product management group director for automotive safety in the S... » read more

Is The 2.5D Supply Chain Ready?

By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Rethinking Patents

By Brian Bailey - 28 May, 2015 - Comments: 0

Over the past few years the pressure on the patent system as a means of protecting intellectual property has been tested to the limit, and many changes are being made in an attempt to keep it viable. But in an age of globalization, coupled with the fact that for the patent system to work there has to be an infrastructure of suitable enforcement, it may be time to rethink its viability—especia... » read more

The Week In Review: Design

By Ed Sperling - 24 Oct, 2014 - Comments: 0

IP Cadence rolled out a portfolio of stacked die memory verification IP to support Wide I/O-2, Hybrid Memory Cube, high-bandwidth memory, and DDR4-3DS. Included are direct memory access for read, write, save, preload and comparison of memory contents, assertions, error configurability, and a built-in address manager. ARM rolled out additions to its enterprise-class SoC interconnects for qua... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 26 Sep, 2014 - Comments: 0

Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Marvell