Experts At The Table: Process Technology Challenges

By Mark LaPedus - 05 Sep, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future transistor, process and manufacturing challenges with Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Carlos Mazure, chief technical officer at Soitec; Raj Jammy, senior vice president and general manager of the Semiconductor Group at Intermolecular; and Girish Dixit, v... » read more

It’s A Materials World

By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus At a recent event, Intel’s fab materials guru described a nightmarish occurrence that nearly brought the chip giant to its knees. Tim Hendry, director of fab materials and vice president of the Technology and Manufacturing Group at Intel, said the company obtained a critical material from an undisclosed supplier. “This large sub-supplier, a very large chemical company, m... » read more

Material Impact

By Barry Pangrle - 08 Aug, 2013 - Comments: 0

Ed Sperling’s June article New Approaches to Better Performance and Lower Power took a look at the new materials that researchers are examining for future technology nodes. Figure 1. Basic Planar CMOS FET Figure 1 shows a basic diagram of a planar CMOS FET (diagrams for other FETs can be found here). The drive strength of a FET is proportional to , where μ is the surface mobility for... » read more

Changes And Challenges

By Ed Sperling - 18 Jul, 2013 - Comments: 0

At 130nm, the shift to copper interconnects and 300mm wafer sizes was considered to be the most difficult transition in its long and incredibly efficient history. The next chapter will be even tougher. It’s not that change is a foreign concept to semiconductor design and manufacturing. In fact, it’s probably the only constant over the past 50 years. But in the past, those changes tended ... » read more

New Approaches To Better Performance And Lower Power

By Ed Sperling - 11 Jul, 2013 - Comments: 0

By Ed Sperling Until 90nm, every feature shrink and rev of Moore’s Law included a side benefit of better power and performance. After that, improvements involved everything from different back-end processes to copper interconnects and transistor structures. But from 20nm onward, the future will rest with a combination of new materials, new architectures and new packaging approaches—and som... » read more

New Materials And Collaboration

By Tom Morrow - 15 Nov, 2012 - Comments: 0

By Tom Morrow John Smythe, advanced technology lead for Micron’s Advanced Materials Technology Group, kicked off the 2012 Strategic Materials Conference (SMC) on Oct. 23, with a comprehensive overview of the materials challenges to continued scaling in memory, including a status update on several novel and emerging materials sets that may have potential at sub-20nm. How the industry w... » read more

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tag: materials

Experts At The Table: Process Technology Challenges

It’s A Materials World

Material Impact

Changes And Challenges

New Approaches To Better Performance And Lower Power

New Materials And Collaboration

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