The Future Of Medical Device Certification: Greater Scrutiny And More Validation

By Mentor, a Siemens Business - 02 Oct, 2014 - Comments: 0

Given the critical nature of the functions performed by today’s medical devices, greater scrutiny along with the need for more certifiable software is on this rise. There is more interest today in government standards such as FDA 510K and IEC 62304 for medical device software. Enhanced scrutiny from government agencies can introduce unexpected delays – or even jeopardize the commercial rele... » read more

‘Hardening’ SoCs For Automotive Market Challenges

By Kurt Shuler - 26 Sep, 2014 - Comments: 0

The semiconductor is enamored with the automotive, industrial and medical markets, and many companies are now shifting their focus there. But many mainstream vendors will face challenges entering this market. For those who have traditionally participated in the smart phone or mobility market, I will outline some changes they need to consider to successfully compete in these emerging spaces. ... » read more

Infrastructure, Then Integration

By Ed Sperling - 04 Aug, 2014 - Comments: 0

In any business and in any business segment, you have to start somewhere and then figure out what the likely end points will be and how to get there. It’s no different with the Internet of Things, except that the integration of different markets or applications is rather fuzzy at the moment. For example, it’s pretty easy to predict the possibilities for a car. It will likely move from co... » read more

How Effective Power Management Increases The Lifetime Operation Of Portable Medical Devices

By Mentor, a Siemens Business - 09 Jul, 2014 - Comments: 0

To enable remote patient care and provide increased mobility in hospital settings portable medical devices, Personal Area Networks (PANs), and home health systems are seeing a significant increase in investment spending. When designing a portable medical device, decisions on processor and component selection are dependent on a range of variables which include performance, price, quality, and re... » read more

Securing Your Intestinal Data

By Ernest Worthman - 05 Jun, 2014 - Comments: 0

Medical devices that use IP or wireless protocols to pass data and instruction between the host and the client aren’t all that unique. What is unique is the diversity, intensity, and depth of today’s security breaches, particularly in the face of the emerging Internet of Things/Everything (IoT/E) and the general lack of security across such medical devices. These elements can lay these medi... » read more

Mentor Buys Berkeley Design

By The SE Staff - 21 Mar, 2014 - Comments: 0

Mentor Graphics announced today that it has acquired Berkeley Design Automation, staking a claim on the expanding market for analog, mixed-signal and RF verification. The deal puts Mentor on firm footing against Synopsys and Cadence, just as the opportunity for the Internet of Things (IoT), including automotive and medical design, begins to show real promise. Until this move, Mentor has larg... » read more

Smart Power on SOI

By Various Writers - 06 Jun, 2011 - Comments: 0

By Adele Hars What if you had to reduce power dissipation by 40x? That's exactly the task that fell to STMicroelectronics, under an EU program called Smart Power Management. At the recent ISPSD (International Symposium on Power Semiconductor Devices and ICs) conference, ST and partners (GE Vingmed Ultrasound and Sintef) presented a paper on how they did it, using ST's latest SOI-based ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer