tag: memory bandwidth

Designing AI Hardware To Deal With Increasingly Challenging Memory Wall (UC Berkeley)
By Technical Paper Link - 25 Mar, 2024 - Comments: 0

A new technical paper titled "AI and Memory Wall" was published by researchers at UC Berkeley, ICSI, and LBNL. Abstract "The availability of unprecedented unsupervised training data, along with neural scaling laws, has resulted in an unprecedented surge in model size and compute requirements for serving/training LLMs. However, the main performance bottleneck is increasingly shifting to memo... » read more

Redesigning Core and Cache Hierarchy For A General-Purpose Monolithic 3D System
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A technical paper titled "RevaMp3D: Architecting the Processor Core and Cache Hierarchy for Systems with Monolithically-Integrated Logic and Memory" was published by researchers at ETH Zürich, KMUTNB, NTUA, and University of Toronto. Abstract: "Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip with fine-graine... » read more

Memory Bandwidth Regulation on Hybrid NVM/DRAM Platforms
By Technical Paper Link - 20 Apr, 2022 - Comments: 0

New technical paper from Shanghai Jiao Tong University Abstract "Non-volatile memory (NVM) has emerged as a new memory media, resulting in a hybrid NVM/DRAM configuration in typical servers. Memory-intensive applications competing for the scant memory bandwidth can yield degraded performance. Identifying the noisy neighbors and regulating the memory bandwidth usage of them can alleviate th... » read more

Improving Edge Inferencing
By Ed Sperling - 02 May, 2019 - Comments: 0

Cheng Wang, senior vice president of engineering at Flex Logix, talks with Semiconductor Engineering about how to improve the efficiency and speed of edge inferencing chips, what causes bottlenecks, and why AI chips are different from other types of semiconductors. » read more

Tech Talk: 2.5D Issues
By Ed Sperling - 25 Feb, 2016 - Comments: 0

Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

Architecturally Optimizing Memory Bandwidth
By Ann Mutschler - 27 Mar, 2015 - Comments: 0

Making sure that an SoC’s [getkc id="22" kc_name="memory"] bandwidth is optimized is a crucial part of the design process today given its significance toward overall system performance. There are many ways to approach this issue, and all of them can have a direct bearing on the competitiveness of a chip in terms of both power and performance. So where should you start? “Number one, c... » read more

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