tag: memory

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Power/Performance Bits: Jan. 14
By Jesse Allen - 14 Jan, 2019 - Comments: 0

Optical memory Researchers at the University of Oxford, University of Exeter, and University of Münster propose an all-optical memory cell that can store more optical data, 5 bits, in a smaller space than was previously possible on-chip. The optical memory cell uses light to encode information in the phase change material Ge2Sb2Te5. A laser causes the material to change between ordered and... » read more

Architecting a Hardware-Managed Hybrid DIMM Optimized for Cost/Performance
By Rambus - 09 Jan, 2019 - Comments: 0

Authors: Fred Ware,(1) Javier Bueno,(2) Liji Gopalakrishnan,(1) Brent Haukness,(1) Chris Haywood,(1) Toni Juan,(2) Eric Linstadt,(1) Sally A. McKee,(3) Steven C. Woo,(1) Kenneth L. Wright,(1) Craig Hampel,(1) Gary Bronner.(1) (1) Rambus Inc. Sunnyvale, California (2) Metempsy, Barcelona, Spain (3) Clemson University, South Carolina Rapidly evolving workloads and exploding data volumes ... » read more

Chip Industry In Rapid Transition
By Ed Sperling - 09 Jan, 2019 - Comments: 0

Wally Rhines, CEO Emeritus at Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about global economics, AI, the growing emphasis on customization, and the impact of security and higher abstraction levels. What follows are excerpts of that conversation. SE: Where do you see the biggest changes happening across the chip industry? Rhines: 2018 was a hot year for fab... » read more

What’s the Right Path For Scaling?
By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Top Stories For 2018
By Brian Bailey - 20 Dec, 2018 - Comments: 0

Each year, I look back to see what articles people like to read. The first thing that has amazed me each year at Semiconductor Engineering is that what should be a strong bias towards articles published early in the year never seems to play out. The same is true this year. More than half of the top articles were published after July. The second thing that remains constant is that people love... » read more

Fab Equipment Challenges For 2019
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND ... » read more

Foundries See Growth, New Issues In 2019
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

The silicon foundry business is poised for growth in 2019, although the industry faces several challenges across a number of market segments next year. Generally, foundry vendors saw steady growth in 2018, but many are ending the year on a sour note. Weak demand for Apple’s new iPhone XR and a downturn in the cryptocurrency market have impacted several IC suppliers and foundries, causing t... » read more

5 Observations From Intel’s Event
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

Not long ago, Intel hosted its “Architecture Day,” where top executives from the chip giant revealed the company’s latest products and next-generation technologies. The company also discussed its strategy. To be sure, it’s a critical time for Intel. In June, Brian Krzanich was forced out as chief executive and the company is still looking for a permanent CEO. Plus, Intel has delayed it... » read more

Mixed Outlook For Fab Equipment
By Christian Dieseldorff - 17 Dec, 2018 - Comments: 0

As 2018 dawned, the semiconductor industry appeared to be poised for a rare fourth consecutive year of equipment investment growth. That rosy outlook is about to change as clouds gather in what until now has been the sunny sky. The latest edition of the World Fab Forecast Report, published by SEMI in December 2018, reveals a downward revision of total fab equipment spending growth for 2018 ... » read more

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