tag: memory

Fearless chip and fab tool forecasts
By Mark LaPedus - 24 Jan, 2019 - Comments: 1

2019 is expected to be a challenging, if not confusing, year for the semiconductor and fab equipment industries. For example, Apple recently issued a warning about lackluster smartphone demand, which impacted several IC vendors and foundries. Then, the memory market is plummeting. In addition, the 10nm/7nm transition has proven to be difficult for many. And let’s not forget the geopolitica... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

Much Ado About Memory
By Lam Research - 24 Jan, 2019 - Comments: 0

New semiconductor applications are ever changing and improving our lives, from new smartphones and wearables to healthcare, factory automation, and artificial intelligence. The humble memory chip working in the background plays a critical role in enabling these technologies. For example, that awesome picture you just took would be lost forever without memory. Your computer can’t perform the i... » read more

Power/Performance Bits: Jan. 22
By Jesse Allen - 22 Jan, 2019 - Comments: 0

Efficient neural net training Researchers from the University of California San Diego and Adesto Technologies teamed up to improve neural network training efficiency with new hardware and algorithms that allow computation to be performed in memory. The team used an energy-efficient spiking neural network for implementing unsupervised learning in hardware. Spiking neural networks more closel... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Power/Performance Bits: Jan. 14
By Jesse Allen - 14 Jan, 2019 - Comments: 0

Optical memory Researchers at the University of Oxford, University of Exeter, and University of Münster propose an all-optical memory cell that can store more optical data, 5 bits, in a smaller space than was previously possible on-chip. The optical memory cell uses light to encode information in the phase change material Ge2Sb2Te5. A laser causes the material to change between ordered and... » read more

Architecting a Hardware-Managed Hybrid DIMM Optimized for Cost/Performance
By Rambus - 09 Jan, 2019 - Comments: 0

Authors: Fred Ware,(1) Javier Bueno,(2) Liji Gopalakrishnan,(1) Brent Haukness,(1) Chris Haywood,(1) Toni Juan,(2) Eric Linstadt,(1) Sally A. McKee,(3) Steven C. Woo,(1) Kenneth L. Wright,(1) Craig Hampel,(1) Gary Bronner.(1) (1) Rambus Inc. Sunnyvale, California (2) Metempsy, Barcelona, Spain (3) Clemson University, South Carolina Rapidly evolving workloads and exploding data volumes ... » read more

Chip Industry In Rapid Transition
By Ed Sperling - 09 Jan, 2019 - Comments: 0

Wally Rhines, CEO Emeritus at Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about global economics, AI, the growing emphasis on customization, and the impact of security and higher abstraction levels. What follows are excerpts of that conversation. SE: Where do you see the biggest changes happening across the chip industry? Rhines: 2018 was a hot year for fab... » read more

What’s the Right Path For Scaling?
By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Top Stories For 2018
By Brian Bailey - 20 Dec, 2018 - Comments: 0

Each year, I look back to see what articles people like to read. The first thing that has amazed me each year at Semiconductor Engineering is that what should be a strong bias towards articles published early in the year never seems to play out. The same is true this year. More than half of the top articles were published after July. The second thing that remains constant is that people love... » read more

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