tag: memory

GDDR6 PHYs: From The Data Center To Self-Driving Cars
By Frank Ferro - 08 Feb, 2018 - Comments: 0

The demand for ever-increasing bandwidth has resulted in a growing interest in GDDR across a number of market verticals, including data centers and the automotive sector. As an example of the former, deep learning applications require ever-increasing speed and bandwidth memory solutions in the data center. In deep learning and other emerging technologies, GDDR memory can help companies addre... » read more

ATE Tailwind For 2018?
By Jeff Dorsch - 05 Feb, 2018 - Comments: 0

The automatic test equipment market enjoyed a record sales year during 2017, and there are indications that the good times will continue this year. Forecasters are predicting another robust year for sales of DRAMs and NAND flash memory devices, especially 3D NAND. That will drive demand for memory test equipment to keep up. Frost & Sullivan predicts semiconductor test equipment will h... » read more

Going Beyond GPUs With GDDR6
By Rambus - 31 Jan, 2018 - Comments: 0

Supported by Micron Technology, SK Hynix and Samsung, GDDR6 SGRAM will feature a maximum data transfer rate of 16 Gbps, along with an operating voltage of 1.35V. Although initially targeted at game consoles and PC graphics, the latest iteration of GDDR is expected to be deployed across multiple verticals, with Micron specifically highlighting the data center and automotive sector. Similarly,... » read more

Power/Performance Bits: Jan. 23
By Jesse Allen - 23 Jan, 2018 - Comments: 0

Atomristors for thin memory Engineers at The University of Texas at Austin and Peking University developed a thin memory storage device with dense memory capacity. Dubbed "atomristors," the device enables 3-D integration of nanoscale memory with nanoscale transistors on the same chip. "For a long time, the consensus was that it wasn't possible to make memory devices from materials that were... » read more

Predictions: Manufacturing, Devices And Companies
By Brian Bailey - 18 Jan, 2018 - Comments: 0

Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

The Week In Review: Design
By Jesse Allen - 12 Jan, 2018 - Comments: 0

M&A Synopsys acquired one-time programmable non-volatile memory IP provider Kilopass. Founded in 2001, Kilopass' 1T and 2T bitcell IP supports up to 4-Mbit OTP instances in 180-nm to 7-nm process technologies. The acquisition will add to Synopsys' growing OTP NVM portfolio: last October, Synopsys acquired Sidense, another provider of the technology. Terms of the deal were not disclosed. ... » read more

The Data Center In 2018 And Beyond
By Steven Woo - 11 Jan, 2018 - Comments: 0

As computing continues to evolve, a number of trends are continuing to challenge the design of conventional von Neumann architectures, and in turn are driving the development of new architectural approaches and technologies. These include the growing adoption of artificial intelligence (AI), machine learning, AR/VR, IoT, high-speed financial transactions, self-driving vehicles, and blockchain/c... » read more

Pushing DRAM’s Limits
By Kevin Fogarty - 14 Dec, 2017 - Comments: 1

If humans ever do create a genuinely self-aware artificial intelligence, it may well exhibit the frustration of waiting for data arrive. The access bandwidth of DRAM-based computer memory has improved by a factor of 20x over the past two decades. Capacity increased 128x during the same period. But latency improved only 1.3x, according to Kevin Chang, a researcher at Carnegie Mellon Universit... » read more

Fan-Outs vs. TSVs
By Jeff Dorsch - 13 Dec, 2017 - Comments: 0

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Enabling Automotive Design
By Ann Mutschler - 07 Dec, 2017 - Comments: 0

Falling automotive electronics prices, propelled by advances in chip manufacturing and innovations on the design side, are driving a whole new level of demand across the automotive industry. Innovations that were introduced at the luxury end of the car market over the past couple years already are being implemented in more standard vehicles. The single biggest driver of change in the automo... » read more

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