tag: MEMS

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 04 Oct, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Multi-Physics Combats Commoditization
By Brian Bailey - 14 Sep, 2017 - Comments: 0

The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison, analog circuits have increased in size by a factor of 10. The primary reason is that digital logic managed to isolate many of the physical effects from functionality, and to provide abstractions ... » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 11 Sep, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Whither Xcerra?
By Jeff Dorsch - 11 Sep, 2017 - Comments: 0

Trade tensions between the People’s Republic of China and the Trump Administration could sink a big transaction in the automatic test equipment business. Xcerra, a supplier of semiconductor test systems, board testers, and electronic interconnects, announced in April that it had accepted an offer from Unic Capital Management, an affiliate of Sino IC Capital, to acquire the company for $10.... » read more

How To Build An IoT Chip
By Ed Sperling - 07 Sep, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss IoT chip design issues with Jeff Miller, product marketing manager for electronic design systems in the Deep Submicron Division of [getentity id="22017" e_name="Mentor, a Siemens Business"]; Mike Eftimakis, IoT product manager in [getentity id="22186" comment="ARM"]'s Systems and Software Group; and John Tinson, vice president of sales at Sondrel Lt... » read more

Combining CMOS IC And MEMS Design For IoT Edge Devices
By Nicolas Williams - 07 Sep, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved. But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. For many years, Tanner has provided customers the ability to interweave MEMS design into this flow, supporting a top-down MEMS IC fl... » read more

Lam Research Acquires Coventor
By Mark LaPedus - 31 Aug, 2017 - Comments: 0

In a move to expand its product portfolio, Lam Research has acquired Coventor, a provider of simulation and modeling solutions for the semiconductor and MEMS industries. With the acquisition of Coventor, fab tool vendor Lam enters the simulation and modeling technology market. Coventor sells the so-called SEMulator3D modeling and analysis platform, which simulates a fab process flow. The “... » read more

The 200mm Equipment Scramble
By Ed Sperling - 23 Aug, 2017 - Comments: 0

An explosion in 200mm demand has set off a frenzied search for used semiconductor manufacturing equipment that can be used at older process nodes. The problem is there is not enough used equipment available, and not all of the new or expanding 200mm fabs can afford to pay the premium for refurbished or new equipment. This may sound like a straightforward supply and demand issue, but behind t... » read more

Is Design Innovation Slowing?
By Brian Bailey - 10 Aug, 2017 - Comments: 0

Paul Teich, principal analyst for Tirias Research, gave a provocative talk at the recent DAC conference entitled, "Is Integration Leaving Less Room for Design Innovation?" The answer isn't as simple as the question might suggest. "Integration used to be a driver for increasing the functionality of silicon," Teich said. "Increasingly, it will be used to incorporate more features of an entire ... » read more

IP Challenges Ahead
By Brian Bailey - 10 Aug, 2017 - Comments: 0

The revenue from semiconductor [getkc id="43" kc_name="IP"] has risen steadily to become the largest segment of the EDA industry. Industry forecasts expect it to keep growing at a CAGR of more than 10% for the next decade. Part one of this article examined the possibility those forecasts are wrong and that large semiconductor companies are likely to start bringing IP development back in hous... » read more

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