tag: Mentor Graphics

More Than Moore
By Ed Sperling - 15 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the value of feature shrinks and what comes next with Steve Eplett, design technology and automation manager at [getentity id="22664" e_name="Open-Silicon"]; Patrick Soheili, vice president and general manager of IP Solutions at [getentity id="22242" e_name="eSilicon"]; Brandon Wang, engineering group director at [getentity id="22032" e_name="Cadenc... » read more

How Reliable Is Your IP?
By Ed Sperling - 12 Sep, 2014 - Comments: 0

Almost everyone who has bought a new smartphone, car, home electronics device or appliance either has experienced technical glitches that require a replacement or repair, or they know someone who has experienced these problems. The good news is that only a very small fraction of the electronic glitches or failures can be contributed to hardware design. Most of it is due to manufacturing vari... » read more

Week 14: To My Fellow Procrastinators
By Anne Cirkel - 12 Sep, 2014 - Comments: 1

“The psychological principle is this: Anyone can do any amount of work, provided it isn’t the work he is supposed to be doing at that moment.” — Robert Benchley, American humorist, 1930 Are you a procrastinator? For the record, I am. My creative juices flow much better when I’m under deadline. However my tendency to delay does have downside. Last weekend we had planned to go backpack... » read more

Making Chips Run Faster
By Ed Sperling - 11 Sep, 2014 - Comments: 3

For all the talk about low power, the real focus of most chipmakers is still performance. The reality is that OEMs might be willing to sacrifice increasing performance for longer battery life, but they will rarely lower performance to reach that goal. This is more obvious for some applications than others. A machine monitor probably isn’t the place where performance will make much of a dif... » read more

Design For IoT
By Ann Mutschler - 11 Sep, 2014 - Comments: 0

In our already mind-bogglingly connected world where you can control your BMW with a Samsung smartwatch or monitor and pay your parking meter with a credit card on your smartphone, the semiconductor design community is mulling over the opportunities from design kits to embedded software as far as the best ways to equip design teams for the [getkc id="76" comment="Internet of Things"] (IoT) era.... » read more

Extending Power Analysis To The Emulation of Complex SoCs
By Jim Kenney - 11 Sep, 2014 - Comments: 0

Using hardware emulation to estimate SoC power consumption delivers significant value. Emulators are capable of long runs on large designs, making it practical to emulate an RTOS boot sequence or graphics processing of multiple frames. Estimating power consumption of these advanced functions executing across the complete SoC provides valuable insight into the chip’s power draw and its impact ... » read more

Blog Review: Sept. 10
By Ed Sperling - 10 Sep, 2014 - Comments: 0

eSilicon’s Mike Gianfagna is searching for patterns and trends in the industry, ranging from big data and the cloud to the IoT. Check out the four V’s. The market for wearables is gaining momentum. Apple made a huge deal out of its Apple Watch this week, but it wasn’t alone. ARM’s David Maidment is on the ground in Berlin looking at the new gear based on Android. Mentor’s John... » read more

Smart Grid Security
By Mentor, a Siemens Business - 10 Sep, 2014 - Comments: 0

Smart energy is an all-inclusive term that refers to upgrading the energy grid so it can support bi-directional flow of energy and data. Such an endeavor involves adding connectivity, communication, and security features not only to the smart grid but to the many devices connected to a smart grid. But how do you ensure all devices on the network are secure? This paper looks into two key softwar... » read more

Stacked Die Politics, Technology And Tools
By Ed Sperling - 08 Sep, 2014 - Comments: 0

The path to stacking die may look fairly straightforward, but reality is somewhat different. There is a battle raging between foundries and OSATs over who will actually stack and package the die. There is new technology being created that could change the economics of how these die go together. And there is debate about just how ready the tools are to make all of this happen. All of this is ... » read more

The Week In Review: Design
By Ed Sperling - 05 Sep, 2014 - Comments: 0

Tools Mentor Graphics unveiled a hypervisor with configuration, debugging and hardware support. The solution is aimed at a variety of vertical markets, ranging from industrial and medical to consumer electronics. NXP uncorked a passive Inter-Integrated Circuit (I²C) solution for near-field communications tagging, allowing appliances, wearables and consumer electronics to use existing NFC-... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy