Continuous, Connected And Concurrent Verification


By Ed Sperling It’s a wonder that any electronic system works as intended, or that it continues to work months or years after it is sold. The reason: SoCs have become so complex that no verification coverage model is sufficient anymore, no methodology covers every aspect of verification, and no single tool or even collection of tools can catch every bug or prevent them from being there in th... » read more

Experts At The Table: Verification Strategies


By Ed Sperling System-Level Design sat down to discuss verification strategies and changes with Harry Foster, chief verification scientist at Mentor Graphics: Janick Bergeron, verification fellow at Synopsys; Pranav Ashar, CTO at Real Intent; Tom Anderson, vice president of marketing at Breker Verification Systems; and Raik Brinkmann, president and CEO of OneSpin Solutions. What follows are e... » read more

Observation Post


By Pranav Ashar After attending the 2013 Design and Verification Conference (DVCon) in San Jose, Calif., I have compiled notes as both an observer and a panel participant. Here are my observations: Wally Rhines, CEO of Mentor Graphics, gave the keynote presentation: Accelerating EDA Innovation Through SoC Design Methodology Convergence. Logically and effectively he made the case that SoC in... » read more

The Best Abstraction


By Jon McDonald The other day I was asked what would be the best level of abstraction to model at for system-level design. This is a question I get, in one form or another, far too often. It reminds me of an old quote attributed to Lincoln, slightly updated and applied to this subject: “One model can answer some of the questions all of the time, and all of the questions some of the time, but... » read more

Market Realities


The speculation about EDA’s future—will it consolidate, will it be incorporated into large IDMs or foundries—has surfaced again. The reason this time is that EDA is in a retrenchment period as the semiconductor industry grapples with increasing complexity, multiple options ranging from multi-patterning to stacked die to more third-party IP, and the rising cost of complex SoCs at the mo... » read more

How To Reduce The Need For Guardbanding A Flash ADC Design


For sensitive mixed-signal designs at small process nodes, the influence of parasitic elements is growing with the increasing interactions among devices and interconnects that are in close proximity. Circuits are highly sensitive to these parasitic effects, and accurate parasitic extraction is critical for first silicon success. New 3D parasitic extraction technology applied to a flash ADC circ... » read more

Experts At The Table: The Trouble With Low-Power Verification


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power verification with Leah Clark, associate technical director at Broadcom; Erich Marschner, product marketing manager at Mentor Graphics; Cary Chin, director of marketing for low-power solutions at Synopsys; and Venki Venkatesh, senior director of engineering at Atrenta. What follows are excerpts of that conversat... » read more

Verifying Your Intent


Design rule checking (DRC), layout versus schematic (LVS) and electrical rule checking (ERC) are physical verification techniques that are mandatory today to check a design and its structures before manufacturing. Checking electrical characteristics of a design is one thing. Verifying power intent is quite another. And the overlap of the two is an intriguing concept. Case in point: Checking fo... » read more

Chasing Rabbits


“Now, here, you see, it takes all the running you can do, to keep in the same place. If you want to get somewhere else, you must run at least twice as fast as that!” —Lewis Carroll, Through the Looking Glass By David Abercrombie As I discussed in my previous article, the use of stitching can greatly reduce the number of double patterning (DP) decomposition violations that a designer ... » read more

Computational Lithography


Computational lithography has become an integral part of design since the 130 nm process node. New techniques continue to be developed to extend the steady node shrink year after year. To read this white paper, click here. » read more

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