tag: Mentor Graphics

Smarter Design Strategies
By Jon McDonald - 26 Apr, 2012 - Comments: 0

By Jon McDonald I had an interesting discussion with a customer recently. They were involved in the architectural specification of a fairly complex piece of silicon. They spent a significant amount of time designing the part to work under worst-case power characteristics and defining the power supply requirements for the device in this worst-case use mode. The conversation started with the ... » read more

Roundtable: Bridging Hardware And Software
By Ed Sperling - 25 Apr, 2012 - Comments: 0

System-Level Design talks about where the problems are with hardware-software co-design and how much progress we've made with Narendra Konda of Nvidia, Frank Schirrmeister of Cadence, Shabtay Matalon of Mentor Graphics, Kurt Shuler of Arteris and Jack Greenbaum of Green HIlls Software. [youtube vid=EOUPsDOYGq8] » read more

Finite Math
By Ed Sperling - 13 Apr, 2012 - Comments: 0

In his keynote speech at the Mentor User-To-User conference yesterday, Sameer Halepete, Nvidia’s vice president of LSI engineering, made a very interesting point. At all levels of computing, from smartphones to the data center, the power budget is fixed, and the old ways of addressing it aren’t working. What that means is that there will not be a single solution to reducing power. It ca... » read more

Getting Ready For Stacked Die
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ed Sperling The move toward stacking of die has always been a series of disconnected pieces and vague promises for the future, but in the past few months the scenario has changed radically—and so has the commentary. All three of the Big Three EDA vendors now have at least some of the pieces in place for 2.5D stacking and are working on a full 3D flow. Two of the biggest FPGA vendors, A... » read more

FinFET Vs. Tri-Gate
By Barry Pangrle - 05 Apr, 2012 - Comments: 0

By Barry Pangrle A large portion of the Common Platform Technology Forum, recently held in Santa Clara, was dedicated to presentations about 14nm process technologies and FinFETS. If you missed the event and are interested, many of the presentations are available from a link off of the Common Platform home page. Dick James wrote a nice article about GlobalFoundries’ claim that its FinFETS ar... » read more

Fundamentals For 3D IC Flows
By Ann Mutschler - 05 Apr, 2012 - Comments: 0

While true 3D ICs are a few years off, 2.5D is here. There are some key differences, namely that with 2.5D the interposer is a passive die, but there also are some fundamental shared requirements. Samta Bansal, senior product marketing for Silicon Realization at Cadence asserted that first, the digital, custom and package environments must be seamless. “There has to be a co-design between ... » read more

Three DFM “Litho” Checkpoints at SMIC
By Mentor, a Siemens Business - 03 Apr, 2012 - Comments: 0

Design for manufacturing (DFM) has been an industry buzz word for several years, but now that it is an expected part of every design flow at 40nm and below, we are seeing how the concept of DFM can be successfully deployed. For example, Semiconductor Manufacturing International Corporation (SMIC), one of the world’s largest semiconductor foundries, has established a process for litho checking... » read more

Enterprise Power
By Ed Sperling - 30 Mar, 2012 - Comments: 0

The corporate data center is getting a lot of attention these days. ARM is fighting for a place inside server racks. Cadence has rolled out IP for faster storage standards. And Mentor Graphics has just introduced middleware for embedded Linux. Why? Because unlike the mobile space, where you need billions of units to make margins, in the corporate enterprise you only need millions. Those extr... » read more

Coherency Becomes A Stack Of Issues
By Ed Sperling - 22 Mar, 2012 - Comments: 0

By Ed Sperling As complexity increases and the industry increasingly shifts away from ASICs to SoCs, the concept of coherency is beginning to look more like a stack of issues than a discrete piece of the design. There are at least five levels of coherency that need to be considered already, with more likely to surface as stacked die become mainstream over the next few years. Perhaps even mo... » read more

The Software Side Of Derivatives
By Ed Sperling - 22 Mar, 2012 - Comments: 0

By Ann Steffora Mutschler With the options and perils associated with derivative designs well articulated today, the elephant remaining in the room is, of course, software. The software aspect of derivatives is bit muddier with some claiming the software can be maintained without modification, while others assert this is simply not possible. One indisputable fact is that software develop... » read more

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