tag: Mentor

Software-Defined Vehicle Momentum Grows
By Ann Mutschler - 09 May, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Advancing Automotive Functional Safety Through Analog & Mixed-Signal Fault Simulation
By Siemens EDA - 09 May, 2024 - Comments: 0

The automotive industry is undergoing a major transformation, driven by the rise of electric vehicles, ADAS, connected cars, and autonomous vehicles. Due to the safety-critical nature of automotive applications, the reliability and tolerance to faults in semiconductor designs becomes paramount. This white paper delves into the role of analog fault simulation in the context of automotive functio... » read more

Blog Review: May 8
By Jesse Allen - 08 May, 2024 - Comments: 0

Synopsys' Manuel Mota and Michael Posner look to UCIe as a complete stack for the die-to-die interconnect in multi-die chip designs, finding it can help maintain latency while reducing power and enhancing performance along with providing assurance of interoperability. Cadence's Durlov Khan highlights the Octal SPI interface for serial NAND flash, which enables 8-bit wide high bandwidth synch... » read more

Communication Is Key To Finding And Fixing Bugs In ICs
By Ann Mutschler and Adam Kovac - 08 May, 2024 - Comments: 0

Experts at the Table: Finding and eliminating bugs at the source can be painstaking work, but it also can prevent even greater problems from developing later on. To examine the best ways to tackle this problem, Semiconductor Engineering sat down with Ashish Darbari, CEO at Axiomise; Ziyad Hanna, corporate vice president R&D at Cadence; Jim Henson, ASIC verification software product manager ... » read more

Can Models Created With AI Be Trusted?
By Brian Bailey - 06 May, 2024 - Comments: 0

EDA models that are created using AI need to pass more stringent quality and cost benefit analysis compared to many AI applications in the broader industry. Money is hanging on the line if AI gets it wrong, and all the associated costs must be factored into the equation. Models are some of the most expensive things a development team can create, and it is important to understand the value th... » read more

Chip Industry Week In Review
By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Blog Review: May 1
By Jesse Allen - 01 May, 2024 - Comments: 0

Cadence's Vatsal Patel stresses the importance of having testing and training capabilities for high-bandwidth memory to prevent the entire SoC from becoming useless and points to key HBM DRAM test instructions through IEEE 1500. In a podcast, Siemens' Stephen V. Chavez chats with Anaya Vardya of American Standard Circuits about the growing significance of high density interconnect and Ultra ... » read more

Multi-Die Design Pushes Complexity To The Max
By Ann Mutschler - 29 Apr, 2024 - Comments: 1

Multi-die/multi-chiplet design has thrown a wrench into the ability to manage design complexity, driving up costs per transistor, straining market windows, and sending the entire chip industry scrambling for new tools and methodologies. For multiple decades, the entire semiconductor design ecosystem — from EDA and IP providers to foundries and equipment makers — has evolved with the assu... » read more

Chip Industry Week In Review
By The SE Staff - 26 Apr, 2024 - Comments: 0

President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

EDA Looks Beyond Chips
By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy