tag: Mentor

EDA’s Role Grows For Preventing And Identifying Failures
By Karen Heyman - 08 Jun, 2023 - Comments: 0

The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

How To Answer Five Common Questions About Power Module Current Density
By Wilfried Wessel - 08 Jun, 2023 - Comments: 0

Power module current density is an important factor in determining the efficiency and performance of power modules. This article answers five common questions about power module current density so you can make informed decisions when designing a power module for your application. 1. How many wire bonds are required? Generally, a higher current density requires an increased number of w... » read more

Power Modules: A Four-Dimensional Design Challenge Calls For A Holistic Design And Verification Approach
By Siemens EDA - 07 Jun, 2023 - Comments: 0

A power module is a high-power switching circuit used in applications for electric vehicles, renewable energy, photovoltaics, wind power, and much more. Switching-element IGBTs and MOSFETs are used in these modules. This paper discusses different technologies and the associated design challenges to achieve complex power module requirements like high voltage resistivity up to 1700 V, high curren... » read more

Blog Review: June 7
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Synopsys' Kenneth Larsen and Powerchip's S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density. In a podcast, Siemens' Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing co... » read more

Uncovering Instabilities In Variational-Quantum Deep Q-Networks
By Fraunhofer IIS/EAS - 07 Jun, 2023 - Comments: 0

By Maja Franz (1), Lucas Wolf (1), Maniraman Periyasamy (2), Christian Ufrecht (2), Daniel D. Scherer (2), Axel Plinge (2), Christopher Mutschler (2), Wolfgang Mauerer (1,3) (1) Technical University of Applied Sciences, Regensburg, Germany, (2) Fraunhofer-IIS, Fraunhofer Institute for Integrated Circuits IIS, Division Positioning and Networks, Nuremberg, Germany, (3) Siemens AG, Corporate ... » read more

From Lab To Fab: Increasing Pressure To Fuse IC Processes
By Gregory Haley - 06 Jun, 2023 - Comments: 0

Test, metrology, and inspection are essential for both the lab and the fab, but fusing them together so that data created in one is easily transferred to the other is a massive challenge. The chip industry has been striving to bridge these separate worlds for years, but the economics, speed, and complexity of change require a new approach. The never-ending push toward smaller, better-defined... » read more

Journey From Cell-Aware To Device-Aware Testing Begins
By Laura Peters - 06 Jun, 2023 - Comments: 0

Early results of using device-aware testing on alternative memories show expanded test coverage, but this is just the start. Once the semiconductor industry realized that it was suffering from device failures even when test programs achieved 100% fault coverage, it went about addressing this disconnect between the way defects manifest themselves inside devices and the commonly used fault mod... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 02 Jun, 2023 - Comments: 0

Japanese and American trade officials announced a joint roadmap for cooperation in strengthening global semiconductor supply chains by advancing Japan-U.S. collaboration with emerging and developing countries in the Indo-Pacific. China and South Korea agreed to strengthen dialogue and cooperation on semiconductor industry supply chains with a focus on the supply of key raw materials and ensu... » read more

Week In Review: Design, Low Power
By Jesse Allen - 02 Jun, 2023 - Comments: 0

Arm debuted its latest platform for mobile computing. Arm Total Compute Solutions 2023 adds the new Immortalis-G720 GPU based on the 5th Generation GPU architecture, which redefines parts of the graphics pipeline to reduce memory bandwidth for the next generation of high geometry games and real-time 3D applications. The company also added two new Mali GPUs. In addition, Arm introduced a cluster... » read more

Welcome To EDA 4.0 And The AI-Driven Revolution
By Dan Yu - 01 Jun, 2023 - Comments: 1

By Dan Yu, Harry Foster, and Tom Fitzpatrick Welcome to the era of EDA 4.0, where we are witnessing a revolutionary transformation in electronic design automation driven by the power of artificial intelligence. The history of EDA can be delineated into distinct periods marked by significant technological advancements that have propelled faster design iterations, improved productivity, and fu... » read more

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