tag: Mentor

Building Better Cars Faster
By John Koon - 02 Feb, 2023 - Comments: 0

Carmakers are accelerating their chip and electronic design schedules to remain competitive in an increasingly fast-changing market, but they are encountering gaps in the tooling, the supply chain, and in the methodologies they use to create those cars. While it's easy to envision how CAD software could be used to create the next new vehicle’s 3-D look, and how simulation software helps de... » read more

A New Era In Requirements Management
By Jacob Wiltgen - 02 Feb, 2023 - Comments: 0

Project teams face a host of challenges when developing semiconductors compliant to a safety critical market. ISO 26262 drives state-of-the art safety critical designs for automotive electronics, DO-254 for airborne electronics hardware, and IEC61508 for industrial electronics, to name a few. In the context of ISO 26262, much of the discussion in recent years has been on challenges addressin... » read more

Intelligent Traceability For ISO 26262
By Siemens EDA - 01 Feb, 2023 - Comments: 0

Requirements driven development is a foundational component of any safety critical lifecycle, including ISO 26262, the state-of-the-art standard guiding safety in the development of automotive electronic devices. At face value, requirements seem like a very straight forward concept. Project teams write requirements. Requirements are implemented into the product. The product is tested... » read more

Blog Review: Feb. 1
By Jesse Allen - 01 Feb, 2023 - Comments: 0

Siemens EDA's Harry Foster explores trends in low power design techniques for ICs and ASICs, with 72% of design projects reported actively managing power. Synopsys' Charlie Matar, Rita Horner, and Pawini Mahajan look at the concept of reliability, availability, and serviceability (RAS) in the context of high-performance computing SoC designs and how it can be supported with silicon lifecycle... » read more

Importance Of Qualifying IP Revisions
By Siddharth Ravikumar - 30 Jan, 2023 - Comments: 0

Design intellectual property (IP) is the fundamental building block of the modern system on chip (SoC). As the scale and complexity of SoCs increases, usage of design IP blocks also increases rapidly, as they enable modularization and re-use of design components. As a result, the usage of design IP has grown rapidly in the past decade. An IP data library consists of many views and formats, w... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 27 Jan, 2023 - Comments: 0

The U.S. Department of Defense updated the directive that governs the development and fielding of autonomous and semi-autonomous weapon systems. The revisions include an expanded focus on artificial intelligence, and reference to recently-established organizations like the DoD’s Chief Digital and Artificial Intelligence Office. NIST released a new guidance document aimed at helping organi... » read more

Week In Review: Design, Low Power
By Susan Rambo - 27 Jan, 2023 - Comments: 0

Electronic system design (ESD) industry revenue is up 8.9% from $3,458.2 million in Q3 2021 to $3,767.4 million in Q3 2022 according to a report from SEMI’s ESD Alliance. Read our in-depth take on what this means. In an attempt to make a viable reusable DNA biosensor probe, NIST researchers used an extremely low-power FETdeveloped at CEA-LETI to remove noise in their DNA biosensor circuitr... » read more

Power Issues Causing More Respins At 7nm And Below
By Brian Bailey - 26 Jan, 2023 - Comments: 0

Power consumption has been a major design consideration for some time, but it is far from being a solved issue. In fact, an increasing number of designs have a plethora of power-related problems, and those problems are getting worse in new chip designs. Many designs today are power-limited — or perhaps more accurately stated, thermal-limited. A chip only can consume as much power as it is ... » read more

The QA Exchange Deck In Solido Crosscheck Enables An IP Qualification Handshake
By Siemens EDA - 26 Jan, 2023 - Comments: 0

This paper describes how the QA exchange deck in Siemens EDA’s Solido Crosscheck software can be used to capture and exchange IP qualification requirements. It shows how the QA exchange deck can be used as part of the IP validation framework in Solido Crosscheck to provide an IP signoff handshake between IP suppliers and integrators. To read more, click here. » read more

What Does 2023 Have In Store For Chip Design?
By Brian Bailey - 26 Jan, 2023 - Comments: 0

Predictions seem to be easier to make during times of stability, but they are no more correct than at any other period. During more turbulent times, fewer people are courageous enough to allow their opinions to be heard. And yet it is often those views that are more well thought through, and even if they turn out not to be true, they often contain some very enlightening ideas. 2022 saw some ... » read more

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