Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation

By Synopsys - 24 Oct, 2024 - Comments: 0

Disruptive AR systems will push the limits of optics: limits in design, limits in manufacturing, and limits in overall system integration. The trend of optical components being integrated into more complex miniaturized systems is impacting optical software. Optical design software has been around for decades to design, simulate, and analyze any optical component from lenses and mirrors to light... » read more

Manufacturing Bits: Dec. 9

By Mark LaPedus - 09 Dec, 2019 - Comments: 0

Metalens breakthroughs Using a conventional lithography system, Harvard has developed what researchers call an all-glass, centimeter-scale metalens. A metalens is a flat surface, which makes use of nanostructures to focus light. It’s a disruptive technology that could displace traditional glass-based lenses. Applications include virtual reality (VR) devices, biological imaging techniques ... » read more

Power/Performance Bits: Oct. 22

By Jesse Allen - 22 Oct, 2019 - Comments: 0

Flexible battery Researchers at ETH Zurich developed a flexible thin-film battery that can be bent, stretched, and twisted without interrupting the supply of power. Key to the battery is a new electrolyte and entirely flexible components. "To date, no one has employed exclusively flexible components as systematically as we have in creating a lithium-ion battery," said Markus Niederberger, P... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: metalens

Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation

Manufacturing Bits: Dec. 9

Power/Performance Bits: Oct. 22