Reflections On Photomask Japan 2023: Embracing The Era Of Curvilinear Masks

By Seiji Nagahara - 18 May, 2023 - Comments: 0

In April, 2023, I had the privilege of participating in Photomask Japan 2023 (PMJ2023), a web conference that brought together experts and enthusiasts in the field. The conference commenced with an enlightening keynote talk by Dr. Kurt Ronse of imec on the status and challenges of the high NA EUV ecosystem, presenting roadmaps for the introduction of high NA EUV. I would like to express my grat... » read more

How Metrology Tools Stack Up In 3D NAND Devices

By Laura Peters - 15 May, 2023 - Comments: 0

Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the nonvolatile storage needs of the big data era. 3D NAND is the first truly three-dimensional device in production. It is both a technology driver for new metrology methods and a significant part of ... » read more

Detection Of Contaminants In Positive And Negative Ion Mode Using In-line SIMS With An Oxygen Primary Ion Beam

By Nova - 09 May, 2023 - Comments: 0

Utilizing Secondary Ion Mass Spectrometry (SIMS) for in-line metrology is a newly emerging method of process control that requires contamination-free measurements, enabling SIMS on product wafers. SIMS measurements of negative ions are usually associated with a Cesium primary ion beam. Unfortunately, when Cesium is present in Silicon, it forms trap states in the Si band gap, which can cause ser... » read more

CDSAXS Milestones And Future Growth of X-ray-Based Metrology for 3D Nanostructures Important To Chip Industry

By Technical Paper Link - 20 Apr, 2023 - Comments: 0

A new technical paper titled "Review of the key milestones in the development of critical dimension small angle x-ray scattering at National Institute of Standards and Technology." Abstract: "An x-ray scattering based metrology was conceived over 20 years ago as part of a collaboration between National Institute of Standards and Technology (NIST) and International Business Machines Corporat... » read more

Challenges Grow For CD-SEMs At 5nm And Beyond

By Gregory Haley - 11 Apr, 2023 - Comments: 1

CD-SEM, the workhorse metrology tool used by fabs for process control, is facing big challenges at 5nm and below. Traditionally, CD-SEM imaging has relied on a limited number of image frames for averaging, which is necessary both to maintain throughput speeds and to minimize sample damage from the electron beam itself. As dimensions get smaller, these limitations result in higher levels of n... » read more

Case Study – Rohinni Micro LEDs

By CyberOptics - 11 Apr, 2023 - Comments: 0

Rohinni combines vision, execution and micron-scale electronics to make impossible products possible. Using its patented device-placement technologies, Rohinni, together with its joint venture partners, enables bringing innovative products to market in high volumes, and at greatly reduced cost. Click here to read more. » read more

Easy-To-Use Mechanical Frequency Comb Platform (TU Delft)

By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Mechanical overtone frequency combs" was published by researchers at Delft University of Technology, Ahmedabad University and NIST. Abstract "Mechanical frequency combs are poised to bring the applications and utility of optical frequency combs into the mechanical domain. So far, their main challenge has been strict requirements on drive frequencies and power,... » read more

Evolution Of The EUV Ecosystem Reflected At 2023 Advanced Lithography + Patterning

By Harry Levinson - 16 Mar, 2023 - Comments: 0

As anticipated, this year’s Advanced Lithography + Patterning Symposium was a very informative event, with many interesting papers being presented across a wide range of subjects. Many papers addressed topics relevant to leading-edge lithography, which these days means EUV lithography. With EUV lithography firmly established in high volume manufacturing (HVM), we could see in the presentation... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing

By eBeam Initiative - 15 Mar, 2023 - Comments: 0

Published by the eBeam Initiative Member Companies (February 2023), this list of artificial intelligence (AI) systems used by member companies in their semiconductor manufacturing products shows progress. New examples of systems using AI include: image processing and parameter tuning in lithography tool mask metrology system B-SPline Control Point generation tool sem... » read more

More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images Using SEMI-PointRend

By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A technical paper titled "SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering" was published (preprint) by researchers at imec, University of Ulsan, and KU Leuven. Abstract: "In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by ima... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: metrology