How Metrology Tools Stack Up In 3D NAND Devices


Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the nonvolatile storage needs of the big data era. 3D NAND is the first truly three-dimensional device in production. It is both a technology driver for new metrology methods and a significant part of ... » read more

Detection Of Contaminants In Positive And Negative Ion Mode Using In-line SIMS With An Oxygen Primary Ion Beam


Utilizing Secondary Ion Mass Spectrometry (SIMS) for in-line metrology is a newly emerging method of process control that requires contamination-free measurements, enabling SIMS on product wafers. SIMS measurements of negative ions are usually associated with a Cesium primary ion beam. Unfortunately, when Cesium is present in Silicon, it forms trap states in the Si band gap, which can cause ser... » read more

CDSAXS Milestones And Future Growth of X-ray-Based Metrology for 3D Nanostructures Important To Chip Industry


A new technical paper titled "Review of the key milestones in the development of critical dimension small angle x-ray scattering at National Institute of Standards and Technology." Abstract: "An x-ray scattering based metrology was conceived over 20 years ago as part of a collaboration between National Institute of Standards and Technology (NIST) and International Business Machines Corporat... » read more

Challenges Grow For CD-SEMs At 5nm And Beyond


CD-SEM, the workhorse metrology tool used by fabs for process control, is facing big challenges at 5nm and below. Traditionally, CD-SEM imaging has relied on a limited number of image frames for averaging, which is necessary both to maintain throughput speeds and to minimize sample damage from the electron beam itself. As dimensions get smaller, these limitations result in higher levels of n... » read more

Case Study – Rohinni Micro LEDs


Rohinni combines vision, execution and micron-scale electronics to make impossible products possible. Using its patented device-placement technologies, Rohinni, together with its joint venture partners, enables bringing innovative products to market in high volumes, and at greatly reduced cost. Click here to read more. » read more

Easy-To-Use Mechanical Frequency Comb Platform (TU Delft)


A new technical paper titled "Mechanical overtone frequency combs" was published by researchers at Delft University of Technology, Ahmedabad University and NIST. Abstract "Mechanical frequency combs are poised to bring the applications and utility of optical frequency combs into the mechanical domain. So far, their main challenge has been strict requirements on drive frequencies and power,... » read more

Evolution Of The EUV Ecosystem Reflected At 2023 Advanced Lithography + Patterning


As anticipated, this year’s Advanced Lithography + Patterning Symposium was a very informative event, with many interesting papers being presented across a wide range of subjects. Many papers addressed topics relevant to leading-edge lithography, which these days means EUV lithography. With EUV lithography firmly established in high volume manufacturing (HVM), we could see in the presentation... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing


Published by the eBeam Initiative Member Companies (February 2023), this list of artificial intelligence (AI) systems used by member companies in their semiconductor manufacturing products shows progress. New examples of systems using AI include: image processing and parameter tuning in lithography tool mask metrology system B-SPline Control Point generation tool sem... » read more

More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images Using SEMI-PointRend


A technical paper titled "SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering" was published (preprint) by researchers at imec, University of Ulsan, and KU Leuven. Abstract: "In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by ima... » read more

Metrology Strategies For 2nm Processes


Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are taking on the increasingly 3D nature of structures and the new materials they incorporate. For instance, processes like hybrid bonding, 3D NAND flash devices, and nanosheet FETs are pushing the bo... » read more

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