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Week In Review: Design, Low Power


EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Design, Low Power


Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Week In Review: Design, Low Power


Tools Synopsys introduced a new model for using its EDA tools on the cloud. Synopsys Cloud provides pay-as-you-go access to the company's cloud-optimized design and verification products, with pre-optimized infrastructure on Microsoft Azure to address higher levels of interdependencies in chip development. "As more design flows incorporate AI, requiring even more resources, the virtually unlim... » read more

EDA In The Cloud Is Driving Semiconductor Innovation


In the past decade, the move towards cloud computing occurred primarily in sectors like finance, retail, and healthcare, with the emergence of leading public cloud vendors such as Amazon Web Services (AWS), Microsoft Azure, Google Cloud Platform, and others accelerating the trend. However, the chip design industry has been slower to adopt cloud computing. In the current highly competitive en... » read more

Week In Review: Design, Low Power


Infineon Technologies acquired Syntronixs Asia, which specializes in precision electroplating, a key process in the assembly process of semiconductors. Syntronixs Asia has a workforce of more than 500 people and has been a major service provider for Infineon since 2009. “Through this acquisition, we have made another important step to strengthen the resilience of our supply chain,” said Tho... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Intel’s Mobileye and Sixt SE said they are collaborating on an autonomous ride-hailing services in Munich in 2022. Mobileye will own the robotaxi fleet. Mobileye also recently unveiled its electric autonomous vehicle (AV), which it will use in ridehailing in Munich and Tel Aviv.. To increase the supply of automotive chips, Intel said it will build new chip manufacturing facilit... » read more

Hyperconnectivity, Hyperscale Computing, And Moving Edges


As described in “The Four Pillars of Hyperscale Computing” last year, the four core components that development teams consider for data centers are computing, storage, memory, and networking. Over the previous decade, requirements for programmability have fundamentally changed data centers. Just over a decade ago, in 2010, virtual machines would compute user workloads on CPU-centric archite... » read more

Week In Review: Auto, Security, Pervasive Computing


Security A new certification program for hardware verification engineers from Edaptive Computing Inc (ECI) and OneSpin Solutions promises to help companies meet IC integrity standards for SoC designs for 5G, IoT, AI, automotive, industrial, defense, and avionics. These designs are often complex, with a variety of elements, such as programmable logic and different cores. The OneSpin Formal Veri... » read more

Week In Review: Design, Low Power


Tools & IP SiFive announced OpenFive, a self-contained and autonomous business unit that will offer custom silicon solutions with differentiated IP. OpenFive will be led by Dr. Shafy Eltoukhy, SVP, and general manager of OpenFive. OpenFive debuted with a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chipset based designs for networking, HPC, and AI markets. The D2D p... » read more

Week In Review: Design, Low Power


Tools & IP Rambus debuted 112G XSR/USR PHY IP on TSMC's N7 7nm process. The PHY IP enables die-to-die and die-to-optical engine connectivity for chiplets and co-packaged optics targeting data center, networking, 5G, HPC, and AI/ML applications. It has been demonstrated in silicon to exceed the reach/BER performance of the CEI-112G XSR specification and supports NRZ and PAM-4 signaling at v... » read more

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