tag: Microsoft

Supporting CPUs Plus FPGAs (Part 1)
By Brian Bailey - 27 Mar, 2017 - Comments: 3

While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

The Week In Review: IoT
By Jeff Dorsch - 24 Mar, 2017 - Comments: 0

Services AT&T and IBM are expanding their joint Internet of Things effort to offer AT&T’s new IoT analytics capability, helping customers yield insights from their industrial IoT data. The capability takes in AT&T’s M2X, Flow Designer, Control Center, and other IoT offerings; IBM Watson IoT; the IBM Watson Data Platform; and the IBM Machine Learning Service, part of Watson Data Platform on... » read more

Testing For Security
By Ed Sperling - 06 Mar, 2017 - Comments: 0

Ever since the IoT became a household name, people have been strategizing about ways to utilize non-secure devices to mount an attack. The first instances of using electricity to overload a device's circuits, thereby neutralizing existing security features, came to light in some of the earliest car hacking incidents. These are basically side-channel attacks using what amounts to an electroni... » read more

Embedded FPGAs Come Of Age
By Ann Mutschler - 27 Feb, 2017 - Comments: 0

FPGAs increasingly are being viewed as a critical component in heterogeneous designs, ratcheting up their stature and the amount of attention being given to programmable devices. Once relegated to test chips that ultimately would be replaced by lower-power and higher-performance ASICs if volumes were sufficient, FPGAs have come a long way. Over the last 20 years programmable devices have mov... » read more

The Week In Review: IoT
By Jeff Dorsch - 24 Feb, 2017 - Comments: 0

M&A ARM Holdings this week announced the acquisition of two firms, Mistbase and NextG-Com, to help bring narrowband Internet of Things technology to its chip designs. In addition, the company announced the development of ARM Cordio-N radios to reduce the complexity of adopting cellular IoT connectivity. Meanwhile, Blu Wireless Technology of the U.K. reported that ARM made an equity investment ... » read more

AI Storm Brewing
By Ed Sperling - 23 Feb, 2017 - Comments: 0

AI is coming. Now what? The answer isn't clear, because after decades of research and development, AI is finally starting to become a force to reckon with. The proof is in the M&A activity underway right now. Big companies are willing to pay huge sums to get out in front of this shift. Here is a list of just some of the AI acquisitions announced or completed over the past few years: ... » read more

The Week In Review: IoT
By Jeff Dorsch - 17 Feb, 2017 - Comments: 0

Consortia Optimal+ said this week that it has joined the Industrial Internet Consortium. “The Industrial Internet of Things (IIoT) will have a tremendous impact on industries worldwide. The application of smart manufacturing, combined with the collection and analysis of in-use/field stage data, will deliver powerful insights to brand owners and enable them to achieve dramatic improvements in... » read more

Blog Review: Feb. 15
By Jesse Allen - 15 Feb, 2017 - Comments: 0

Mentor's Jean-Marie Brunet looks at factors driving the growth of hardware emulation for SoCs. Cadence's Dave Pursley asserts that the role of hardware developers is about to change for the better. Synopsys' Robert Vamosi says that major software vulnerabilities are becoming less frequent, in spite of hype surrounding named bugs. ARM's Rhonda Dirvin discusses the release of the OpenFog... » read more

The Week In Review: IoT
By Jeff Dorsch - 10 Feb, 2017 - Comments: 0

Market Research There will be 8.4 billion connected things in use this year, a 31% gain from 2016, and leading up to 20.4 billion connected devices in 2020, according to Gartner. The market research firm estimates worldwide spending on endpoints and services will hit nearly $2 trillion in 2017. Greater China, North America, and Western Europe account for two-thirds of the IoT installed base th... » read more

Chip-Package-Board Issues Grow
By Ann Mutschler - 06 Feb, 2017 - Comments: 0

As systems migrate from a single die in a single package on a board, to multiple dies with multiple packaging options and multiple PCB form factors, it is becoming critical to move system planning, assembly, and optimization much earlier in the design-through-manufacturing flow. This is easier said than done. Multiple tools and operating systems are now used at each phase of the flow, partic... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy