tag: Microsoft

For SDVs, Software Is The Biggest Challenge
By John Koon - 02 Nov, 2023 - Comments: 0

Software-defined vehicles (SDVs) involve far more than just OTA applications enabling software upgrades over the air. Software that will manage hundreds of ECUs and other functions within the vehicle is expected to grow beyond hundreds of millions of lines of code, possibly making SDV software development the number one challenge in automotive design. The benefits of SDVs, such as easy updat... » read more

Chip Industry Week In Review
By The SE Staff - 27 Oct, 2023 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan The Biden-Harris administration designated 31 Tech Hubs across the U.S. this week, focused on industries including autonomous systems, quantum computing, biotechnology, precision medicine, clean energy advancement, and semiconductor manufacturing. The Department of Commerce (DOC) also launched its second Tech Hubs Notice of Funding Opportunity. ... » read more

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Chip Industry Week In Review
By The SE Staff - 06 Oct, 2023 - Comments: 0

By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Data Management Challenges In Heterogeneous Systems
By Ed Sperling - 27 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice presiden... » read more

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Chip Industry Week In Review
By The SE Staff - 08 Sep, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Need To Share Data Widens In IC Manufacturing
By Ed Sperling - 31 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore,... » read more

Security Research: Technical Paper Round-up
By Linda Christensen - 29 Aug, 2023 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

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