Research Bits: May 21


Lithium tantalate PICs Researchers at EPFL and Shanghai Institute of Microsystem and Information Technology developed scalable photonic integrated circuits (PICs) based on lithium tantalate (LiTaO3). Lithium tantalate can provide excellent electro-optic qualities and is used in telecom 5G RF filters. The team developed a wafer-bonding method for lithium tantalate, which is compatible with s... » read more

Research Bits: April 8


Annealing processor Researchers from the Tokyo University of Science designed a scalable, fully-coupled annealing processor with 4096 spins on a single board with 36 CMOS chips, with parallelized capabilities for accelerated solving of combinatorial optimization problems. "We want to achieve advanced information processing directly at the edge, rather than in the cloud, or performing prepro... » read more

Research Bits: May 30


Improving qubits Researchers from QuTech say they have improved the ‘Andreev spin qubit’ by taking the two most promising qubits — the spin qubits in semiconductors and transmon qubits in superconducting circuits — and finding a hybrid way that uses the best of both qubit types. “Spin qubits are small and compatible with current industrial technology, but they struggle with interact... » read more

Scaling Down To 2nm: Using Microwaves For Efficient & Stable Doping


A new technical paper titled "Efficient and stable activation by microwave annealing of nanosheet silicon doped with phosphorus above its solubility limit" was just published by researchers at National Taiwan University, Cornell University, TSMC, University of Valladolid, DSG Technologies, National Central University and National Yang Ming Chiao Tung University. A modified microwave was used... » read more

EDA Software Design Flow Considerations For The RF/Microwave Module Designer


Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design


In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

Packaging Demands For RF And Microwave


RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

Microwave quantum illumination using a digital receiver


Abstract "Quantum illumination is a powerful sensing technique that employs entangled signal-idler photon pairs to boost the detection efficiency of low-reflectivity objects in environments with bright thermal noise. The promised advantage over classical strategies is particularly evident at low signal powers, a feature which could make the protocol an ideal prototype for non-invasive biomed... » read more