A Crisis In DoD’s Trusted Foundry Program?

By Mark LaPedus - 22 Oct, 2018 - Comments: 0

The U.S. Department of Defense’s Trusted Foundry program is in flux due to GlobalFoundries’ recent decision to put 7nm on hold, raising national security concerns across the U.S. defense community. U.S. DoD and military/aerospace chip customers currently have access to U.S.-based “secure” foundry capacity down to 14nm, but that's where it ends. No other foundries provide similar “s... » read more

Verification As A Flow (Part 3)

By Brian Bailey - 24 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the transformation of verification from a tool to a flow with Vladislav Palfy, global manager application engineering for OneSpin Solutions; Dave Kelf, chief marketing officer for Breker Verification Systems; Mark Olen, product marketing group manager for Mentor, A Siemens Business; Larry Melling, product management director, System & Verificati... » read more

How To Make Autonomous Vehicles Reliable

By Ann Mutschler - 11 Sep, 2017 - Comments: 1

The number of unknowns in automotive chips, subsystems and entire vehicles is growing as higher levels of driver assistance are deployed, sparking new concerns and approaches about how to improve reliability of these systems. Advanced Driver Assistance Systems (ADAS) will need to detect objects, animals and people, and they will be used for parking assistance, night vision and collision avoi... » read more

Introduction To DO-254

By Aldec - 26 Aug, 2015 - Comments: 0

For almost two decades, avionics system manufacturers have only had to adhere to DO-178 for the development of airborne software. RTCA/DO-178A was recognized by the Federal Aviation Administration (FAA) in 1985 for the development of airborne software, but RTCA/DO-254 was only recognized by the FAA in 2005 for the development of airborne electronic hardware (AEH). Developers of AEH are now face... » read more

IP And FinFETs At Advanced Nodes

By Ed Sperling - 31 Jul, 2014 - Comments: 2

Semiconductor Engineering sat down to discuss IP and finFETs at advanced nodes with Warren Savage, president and CEO of IPextreme; Aveek Sarkar, vice president of engineering and product support at Ansys-Apache; Randy Smith, vice president of marketing at Sonics, and Bernard Murphy, CTO of Atrenta. What follows are excerpts of that conversation. SE: It’s harder for a fabless semiconductor ... » read more

New Approaches For Reliability

By Ed Sperling - 28 Mar, 2014 - Comments: 0

The definition of reliability hasn’t budged since the invention of the IC, but how to achieve it is starting to change. In safety-critical systems, as well as in markets such as aerospace, demands for reliability are so rigorous that they often require redundant circuitry—and for good reason. A PanAmSat malfunction in 1998 caused by tin whisker growth wiped out pagers for 45 million use... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer